RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
8103010447

8103010447

UFSF,BECU,NID,RL .125X.375

Laird Technologies EMI
2,855 -

RFQ

Bulk ECOGREEN™ Active Gasket Round 0.375 (9.53mm) - 0.125 (3.18mm) Beryllium Copper Unplated - -
0098054019

0098054019

AP,STR,NIB,USFT,PSA .110X.280X.1

Laird Technologies EMI
2,479 -

RFQ

Bulk - Active Fingerstock - 0.787 (20.00mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper Nickel 299.21µin (7.60µm) Adhesive
4692PAX1R03937

4692PAX1R03937

GK,NICU,PTAFG,PU,V0,DSH .140X.25

Laird Technologies EMI
3,831 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam D-Shape 0.250 (6.35mm) 39.370 (1.00m) 0.140 (3.56mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4216PA51H03937

4216PA51H03937

GK,NICU,PTAFG,PU,V0,REC .315X.39

Laird Technologies EMI
3,716 -

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.395 (10.03mm) 39.370 (1.00m) 0.315 (8.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
11-S-37FSC-BD-16

11-S-37FSC-BD-16

0.11 X 0.375 BD 16--FOLDED SERIE

Leader Tech Inc.
3,087 -

RFQ

11-S-37FSC-BD-16

Ficha técnica

Bulk - Active Fingerstock - 0.370 (9.40mm) 16.000 (406.40mm) 0.110 (2.79mm) Beryllium Copper Unplated - Adhesive
0077010502

0077010502

FINGERSTOCK BECU 15.24X406.4MM

Laird Technologies EMI
2,288 -

RFQ

0077010502

Ficha técnica

Box - Active Fingerstock - 0.600 (15.24mm) 16.000 (406.40mm) 0.220 (5.59mm) Beryllium Copper - - Slot
0097011402

0097011402

CSTR,STR,BF .090X.920X.187X16

Laird Technologies EMI
2,180 -

RFQ

Bulk - Active Fingerstock - - - - - Unplated - -
0097043002

0097043002

CSTR,STR,BF

Laird Technologies EMI
2,036 -

RFQ

Bulk Contact Strip Active Fingerstock - - - - Beryllium Copper - - Slot
0097044002

0097044002

CSTR,STR,BF

Laird Technologies EMI
3,639 -

RFQ

0097044002

Ficha técnica

Bulk Large Enclosure Active Fingerstock - 1.630 (41.40mm) 25.00' (7.60m) 0.410 (10.41mm) Beryllium Copper - - Hardware, Rivet, Solder
0C97054117

0C97054117

NOSG COIL SNB PSA

Laird Technologies EMI
2,086 -

RFQ

Bulk Foldover Active Fingerstock - 0.380 (9.65mm) 16.000 (406.40mm) 0.120 (3.05mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
4795PA51H03937

4795PA51H03937

GK,NICU,PTAFG,PU,V0,REC .250X.50

Laird Technologies EMI
3,515 -

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.500 (12.70mm) 39.370 (1.00m) 0.250 (6.35mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0098036017

0098036017

CSTR,STR,SNB,USFT

Laird Technologies EMI
3,317 -

RFQ

Bulk Ultrasoft Contact Strip Active Fingerstock - - - - Beryllium Copper - - Slot
SG315315C-48

SG315315C-48

.315H X .315W X 48L--C FOLD--

Leader Tech Inc.
2,037 -

RFQ

SG315315C-48

Ficha técnica

Bulk - Active Fabric Over Foam C-Fold 0.315 (8.00mm) 4.00' (1.22m) 0.315 (8.00mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
4157PAX1R03937

4157PAX1R03937

GK,NICU,PTAFG,PU,V0,REC .060X.28

Laird Technologies EMI
2,238 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam Rectangle 0.787 (20.00mm) 39.370 (1.00m) 0.630 (16.00mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4695PA51H03937

4695PA51H03937

GK,NICU,PTAFG,PU,V0,SQ 9.5X9.5X1

Laird Technologies EMI
3,077 -

RFQ

Bulk 51H Active Fabric Over Foam Square 0.375 (9.53mm) 39.370 (1.00m) 0.375 (9.53mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097056802

0097056802

FINGERSTOCK BECU 10.4X406.4MM

Laird Technologies EMI
2,670 -

RFQ

0097056802

Ficha técnica

Box Clip-On Twist Active Fingerstock - 0.414 (10.52mm) 16.000 (406.40mm) 0.210 (5.33mm) Beryllium Copper - - Clip
4633PA51H03937

4633PA51H03937

GK,NICU,PTAFG,PU,V0,BELL 2.5X7.6

Laird Technologies EMI
2,119 -

RFQ

Bulk 51H Active Fabric Over Foam Bell 0.300 (7.62mm) 39.370 (1.00m) 0.100 (2.54mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4200PA51G01800

4200PA51G01800

RECTANGLE

Laird Technologies EMI
2,587 -

RFQ

4200PA51G01800

Ficha técnica

Bulk 51G Active Fabric Over Foam Rectangle 0.827 (21.00mm) 18.000 (457.20mm) 0.079 (2.00mm) - - - Adhesive
4231PA51H01800

4231PA51H01800

GASKET FAB/FOAM 41X457.2MM RECT

Laird Technologies EMI
2,578 -

RFQ

4231PA51H01800

Ficha técnica

Bulk 51H Active Fabric Over Foam Rectangle 1.614 (41.00mm) 18.000 (457.20mm) 0.059 (1.50mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4049PA51H04800

4049PA51H04800

GASKET FAB/FOAM 6.35X1219.2MM SQ

Laird Technologies EMI
3,128 -

RFQ

4049PA51H04800

Ficha técnica

Bulk 51H Active Fabric Over Foam Square 0.252 (6.40mm) 48.000 (121.90cm) 0.252 (6.40mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
Total 4831 Record«Prev1... 9293949596979899...242Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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