RFI e EMI - Contatos, Fingerstock e juntas

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type Shape Width Length Height Material Plating Plating-Thickness AttachmentMethod
0097091802

0097091802

FINGERSTOCK BECU 8.9X381MM

Laird Technologies EMI
3,267 -

RFQ

0097091802

Ficha técnica

Box Symmetrical (S3) Slotted Active Fingerstock - 0.350 (8.89mm) 15.000 (381.00mm) 0.110 (2.79mm) Beryllium Copper - - Adhesive
11-35DT-SN-15-NTP

11-35DT-SN-15-NTP

0.11 X 0.35 SN 15 NTP--11-35DT-S

Leader Tech Inc.
2,778 -

RFQ

11-35DT-SN-15-NTP

Ficha técnica

Bulk - Active Fingerstock - 0.350 (8.89mm) 15.000 (381.00mm) 0.110 (2.79mm) Beryllium Copper Tin Flash Adhesive
0097031017

0097031017

CSTR,STR,SNB .281X.484X.187X16

Laird Technologies EMI
2,088 -

RFQ

Bulk - Active Fingerstock - - - - - Tin 299.21µin (7.60µm) -
4186PA51H03600

4186PA51H03600

GK,NICU,PTAFG,PU,V0,REC .080X.20

Laird Technologies EMI
2,108 -

RFQ

Bulk 51H Active Fabric Over Foam Rectangle 0.200 (5.08mm) 36.000 (914.40mm) 0.080 (2.03mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
4242AB51K04800

4242AB51K04800

GK NICU NRS PU V0 DSH

Laird Technologies EMI
2,277 -

RFQ

4242AB51K04800

Ficha técnica

Bulk 51K Active Fabric Over Foam D-Shape 0.252 (6.40mm) 48.000 (121.92cm) 0.252 (6.40mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - -
0C97050017

0C97050017

AP COIL SNB PSA

Laird Technologies EMI
3,060 -

RFQ

Bulk All-Purpose Active Fingerstock - 0.600 (15.24mm) 24.000 (609.60mm) 0.230 (5.84mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0097056417

0097056417

TWT,STR,SNB,CLO

Laird Technologies EMI
2,469 -

RFQ

0097056417

Ficha técnica

Bulk Clip-On Twist Active Fingerstock - 0.210 (5.33mm) 16.000 (406.40mm) 0.140 (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip
0098054102

0098054102

NOSG,STR,BF,USF,PSA

Laird Technologies EMI
3,165 -

RFQ

Bulk Ultrasoft Foldover Active Fingerstock - 0.380 (9.65mm) 16.000 (406.40mm) 0.120 (3.05mm) Beryllium Copper - - Adhesive
0097055502

0097055502

FINGRSTOCK BECU ALY 8.64X609.6MM

Laird Technologies EMI
2,419 -

RFQ

0097055502

Ficha técnica

Box Twist Active Fingerstock - 0.034 (8.64mm) 23.976 (609.00mm) 0.070 (1.78mm) Beryllium Copper Nickel, Tin 299.99µin (7.62µm) Adhesive
0097031002

0097031002

FINGERSTOCK BECU 12.20X381MM

Laird Technologies EMI
2,599 -

RFQ

0097031002

Ficha técnica

Bulk Contact Strip Active - - 0.480 (12.20mm) 15.000 (381.00mm) - - - - -
8100-0015-82

8100-0015-82

.032T X 6.00W--8100-0015-82

Leader Tech Inc.
3,737 -

RFQ

8100-0015-82

Ficha técnica

Bulk - Active Gasket - 6.000 (152.40mm) - 0.032 (0.81mm) Conductive Elastomer - - -
0098095417

0098095417

S3,STR,SNB,USFT,PSA

Laird Technologies EMI
2,888 -

RFQ

Bulk Ultrasoft Symmetrical (S3) Slotted Active Fingerstock - 0.450 (11.43mm) 15.000 (381.00mm) 0.140 (3.56mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
20-38RBCT-BD-16

20-38RBCT-BD-16

0.20 X 0.377 BD 16--20-38RBCT-BD

Leader Tech Inc.
3,230 -

RFQ

20-38RBCT-BD-16

Ficha técnica

Bulk - Active Fingerstock - 0.380 (9.65mm) 16.000 (406.40mm) 0.200 (5.08mm) Beryllium Copper Unplated - Adhesive
4078PAX1R03937

4078PAX1R03937

GK,NICU,PTAFG,PU,V0,DSH .120X.36

Laird Technologies EMI
3,485 -

RFQ

Bulk EcoTemp™ 85 X1R Active Fabric Over Foam D-Shape 0.360 (9.14mm) 39.370 (1.00m) 0.120 (3.05mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive
0097056302

0097056302

FINGERSTOCK BECU 5.33X406.4MM

Laird Technologies EMI
3,737 -

RFQ

0097056302

Ficha técnica

Box Clip-On Twist Active Fingerstock - 0.210 (5.33mm) 16.000 (406.40mm) 0.140 (3.56mm) Beryllium Copper - - Clip
0C97051502

0C97051502

NOSG COIL BF PSA

Laird Technologies EMI
2,229 -

RFQ

0C97051502

Ficha técnica

Bulk Foldover Active Fingerstock - 0.760 (19.30mm) 24.000 (609.60mm) 0.230 (5.84mm) Beryllium Copper - - Adhesive
0097053817

0097053817

AP,STR,SNB,PSA

Laird Technologies EMI
3,933 -

RFQ

0097053817

Ficha técnica

Bulk All-Purpose Active Fingerstock - 0.780 (19.81mm) 24.000 (609.60mm) 0.250 (6.35mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0097061119

0097061119

CLO;STR;TLN;NIB; .100X.300X.182X

Laird Technologies EMI
2,977 -

RFQ

Bulk - Active Fingerstock - 0.300 (7.62mm) 16.000 (406.40mm) 0.170 (4.32mm) Beryllium Copper Nickel 299.21µin (7.60µm) Clip
0097055817

0097055817

TWT,STR,SNB,RAPSA

Laird Technologies EMI
3,088 -

RFQ

0097055817

Ficha técnica

Bulk Twist Active Fingerstock - 0.200 (5.08mm) 24.000 (609.60mm) 0.070 (1.78mm) Beryllium Copper Tin 299.21µin (7.60µm) Adhesive
0097055917

0097055917

TWT,STR,SNB,PSA

Laird Technologies EMI
2,508 -

RFQ

0097055917

Ficha técnica

Bulk Twist Active Fingerstock - 0.300 (7.62mm) 23.976 (609.00mm) 0.070 (1.78mm) Beryllium Copper Tin 299.99µin (7.62µm) Adhesive
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Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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Fudong Communication (Shenzhen) Grupo Co., Ltd.

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