Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-632-41-013101

116-87-632-41-013101

CONN IC DIP SOCKET 32POS GOLD

Preci-Dip
3,966 -

RFQ

116-87-632-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-068-10-061112

614-87-068-10-061112

CONN SOCKET PGA 68POS GOLD

Preci-Dip
2,749 -

RFQ

614-87-068-10-061112

Ficha técnica

Bulk 614 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-148-15-061101

510-83-148-15-061101

CONN SOCKET PGA 148POS GOLD

Preci-Dip
2,834 -

RFQ

510-83-148-15-061101

Ficha técnica

Bulk 510 Active PGA 148 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-148-15-062101

510-83-148-15-062101

CONN SOCKET PGA 148POS GOLD

Preci-Dip
3,208 -

RFQ

510-83-148-15-062101

Ficha técnica

Bulk 510 Active PGA 148 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-169-13-000101

510-83-169-13-000101

CONN SOCKET PGA 169POS GOLD

Preci-Dip
2,071 -

RFQ

510-83-169-13-000101

Ficha técnica

Bulk 510 Active PGA 169 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-068-11-061135

546-83-068-11-061135

CONN SOCKET PGA 68POS GOLD

Preci-Dip
3,736 -

RFQ

546-83-068-11-061135

Ficha técnica

Bulk 546 Active PGA 68 (11 x 11) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-068-11-061136

546-83-068-11-061136

CONN SOCKET PGA 68POS GOLD

Preci-Dip
2,466 -

RFQ

546-83-068-11-061136

Ficha técnica

Bulk 546 Active PGA 68 (11 x 11) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-149-15-003101

510-83-149-15-003101

CONN SOCKET PGA 149POS GOLD

Preci-Dip
3,124 -

RFQ

510-83-149-15-003101

Ficha técnica

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-169-17-101101

510-83-169-17-101101

CONN SOCKET PGA 169POS GOLD

Preci-Dip
3,525 -

RFQ

510-83-169-17-101101

Ficha técnica

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-159-16-071101

510-83-159-16-071101

CONN SOCKET PGA 159POS GOLD

Preci-Dip
3,723 -

RFQ

510-83-159-16-071101

Ficha técnica

Bulk 510 Active PGA 159 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-011101

116-83-650-41-011101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,647 -

RFQ

116-83-650-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-149-15-061101

510-83-149-15-061101

CONN SOCKET PGA 149POS GOLD

Preci-Dip
3,448 -

RFQ

510-83-149-15-061101

Ficha técnica

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-149-15-063101

510-83-149-15-063101

CONN SOCKET PGA 149POS GOLD

Preci-Dip
3,298 -

RFQ

510-83-149-15-063101

Ficha técnica

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-149-15-064101

510-83-149-15-064101

CONN SOCKET PGA 149POS GOLD

Preci-Dip
2,147 -

RFQ

510-83-149-15-064101

Ficha técnica

Bulk 510 Active PGA 149 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-636-41-004101

116-83-636-41-004101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
2,419 -

RFQ

116-83-636-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-160-13-001101

510-83-160-13-001101

CONN SOCKET PGA 160POS GOLD

Preci-Dip
3,170 -

RFQ

510-83-160-13-001101

Ficha técnica

Bulk 510 Active PGA 160 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-652-41-002101

124-83-652-41-002101

CONN IC DIP SOCKET 52POS GOLD

Preci-Dip
3,179 -

RFQ

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-630-10-002101

299-87-630-10-002101

CONN IC DIP SOCKET 30POS GOLD

Preci-Dip
3,888 -

RFQ

299-87-630-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-256-16-000101

510-87-256-16-000101

CONN SOCKET PGA 256POS GOLD

Preci-Dip
2,838 -

RFQ

510-87-256-16-000101

Ficha técnica

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-80-072-11-061101

550-80-072-11-061101

PGA SOLDER TAIL

Preci-Dip
2,969 -

RFQ

550-80-072-11-061101

Ficha técnica

Bulk 550 Active PGA 72 (11 x 11) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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