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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-83-132-14-001101CONN SOCKET PGA 132POS GOLD Preci-Dip |
2,832 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 132 (14 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-223-18-002101CONN SOCKET PGA 223POS GOLD Preci-Dip |
2,335 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-223-18-091101CONN SOCKET PGA 223POS GOLD Preci-Dip |
3,178 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-223-18-092101CONN SOCKET PGA 223POS GOLD Preci-Dip |
2,884 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-223-18-093101CONN SOCKET PGA 223POS GOLD Preci-Dip |
2,888 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-223-18-094101CONN SOCKET PGA 223POS GOLD Preci-Dip |
3,786 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-648-41-001101CONN IC DIP SOCKET 48POS GOLD Preci-Dip |
2,266 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-132-14-071101CONN SOCKET PGA 132POS GOLD Preci-Dip |
3,973 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 132 (14 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
299-87-628-10-002101CONN IC DIP SOCKET 28POS GOLD Preci-Dip |
3,065 | - |
RFQ |
Ficha técnica |
Bulk | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-224-18-091101CONN SOCKET PGA 224POS GOLD Preci-Dip |
3,407 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 224 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
612-83-964-41-001101CONN IC DIP SOCKET 64POS GOLD Preci-Dip |
3,838 | - |
RFQ |
Ficha técnica |
Bulk | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-133-14-071101CONN SOCKET PGA 133POS GOLD Preci-Dip |
3,689 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 133 (14 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-225-17-001101CONN SOCKET PGA 225POS GOLD Preci-Dip |
3,153 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 225 (17 x 17) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-225-17-061101CONN SOCKET PGA 225POS GOLD Preci-Dip |
2,700 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 225 (17 x 17) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-225-15-000101CONN SOCKET PGA 225POS GOLD Preci-Dip |
2,043 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 225 (15 x 15) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-225-18-019101CONN SOCKET PGA 225POS GOLD Preci-Dip |
2,112 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 225 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-632-41-004101CONN IC DIP SOCKET 32POS GOLD Preci-Dip |
2,430 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-328-41-013101CONN IC DIP SOCKET 28POS GOLD Preci-Dip |
2,006 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-428-41-013101CONN IC DIP SOCKET 28POS GOLD Preci-Dip |
3,615 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-628-41-013101CONN IC DIP SOCKET 28POS GOLD Preci-Dip |
2,060 | - |
RFQ |
Ficha técnica |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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