Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-87-428-41-013101

116-87-428-41-013101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,503 -

RFQ

116-87-428-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-192-17-081101

510-87-192-17-081101

CONN SOCKET PGA 192POS GOLD

Preci-Dip
3,127 -

RFQ

510-87-192-17-081101

Ficha técnica

Bulk 510 Active PGA 192 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-125-13-041101

510-83-125-13-041101

CONN SOCKET PGA 125POS GOLD

Preci-Dip
2,126 -

RFQ

510-83-125-13-041101

Ficha técnica

Bulk 510 Active PGA 125 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-008101

116-83-648-41-008101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,251 -

RFQ

116-83-648-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-648-41-011101

116-87-648-41-011101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,713 -

RFQ

116-87-648-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-624-41-013101

116-83-624-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,809 -

RFQ

116-83-624-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-324-41-013101

116-83-324-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,805 -

RFQ

116-83-324-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-424-41-013101

116-83-424-41-013101

CONN IC DIP SOCKET 24POS GOLD

Preci-Dip
3,599 -

RFQ

116-83-424-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-011101

116-83-640-41-011101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
2,579 -

RFQ

116-83-640-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-964-31-012101

614-83-964-31-012101

CONN IC DIP SOCKET 64POS GOLD

Preci-Dip
2,099 -

RFQ

614-83-964-31-012101

Ficha técnica

Bulk 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-201-15-041101

510-87-201-15-041101

CONN SOCKET PGA 201POS GOLD

Preci-Dip
2,760 -

RFQ

510-87-201-15-041101

Ficha técnica

Bulk 510 Active PGA 201 (15 x 15) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-008101

116-83-650-41-008101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,500 -

RFQ

116-83-650-41-008101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-650-41-011101

116-87-650-41-011101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,167 -

RFQ

116-87-650-41-011101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-002101

116-83-650-41-002101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
2,767 -

RFQ

116-83-650-41-002101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
124-83-640-41-002101

124-83-640-41-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,333 -

RFQ

Bulk 124 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-628-41-004101

116-83-628-41-004101

CONN IC DIP SOCKET 28POS GOLD

Preci-Dip
2,365 -

RFQ

116-83-628-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-128-13-041101

510-83-128-13-041101

CONN SOCKET PGA 128POS GOLD

Preci-Dip
3,824 -

RFQ

510-83-128-13-041101

Ficha técnica

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-128-13-042101

510-83-128-13-042101

CONN SOCKET PGA 128POS GOLD

Preci-Dip
2,027 -

RFQ

510-83-128-13-042101

Ficha técnica

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-128-13-043101

510-83-128-13-043101

CONN SOCKET PGA 128POS GOLD

Preci-Dip
2,663 -

RFQ

510-83-128-13-043101

Ficha técnica

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-128-13-071101

510-83-128-13-071101

CONN SOCKET PGA 128POS GOLD

Preci-Dip
3,233 -

RFQ

510-83-128-13-071101

Ficha técnica

Bulk 510 Active PGA 128 (13 x 13) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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