Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
550-80-084-13-081101

550-80-084-13-081101

PGA SOLDER TAIL

Preci-Dip
3,206 -

RFQ

550-80-084-13-081101

Ficha técnica

Bulk 550 Active PGA 84 (13 x 13) 0.100 (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-191-18-091101

510-83-191-18-091101

CONN SOCKET PGA 191POS GOLD

Preci-Dip
3,276 -

RFQ

510-83-191-18-091101

Ficha técnica

Bulk 510 Active PGA 191 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-192-16-001101

510-83-192-16-001101

CONN SOCKET PGA 192POS GOLD

Preci-Dip
2,838 -

RFQ

510-83-192-16-001101

Ficha técnica

Bulk 510 Active PGA 192 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-192-17-081101

510-83-192-17-081101

CONN SOCKET PGA 192POS GOLD

Preci-Dip
2,723 -

RFQ

510-83-192-17-081101

Ficha técnica

Bulk 510 Active PGA 192 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-324-18-000101

510-87-324-18-000101

CONN SOCKET PGA 324POS GOLD

Preci-Dip
3,103 -

RFQ

510-87-324-18-000101

Ficha técnica

Bulk 510 Active PGA 324 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-069-11-061112

614-83-069-11-061112

CONN SOCKET PGA 69POS GOLD

Preci-Dip
2,944 -

RFQ

614-83-069-11-061112

Ficha técnica

Bulk 614 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-273-21-121101

510-87-273-21-121101

CONN SOCKET PGA 273POS GOLD

Preci-Dip
3,208 -

RFQ

510-87-273-21-121101

Ficha técnica

Bulk 510 Active PGA 273 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-299-20-001101

510-87-299-20-001101

CONN SOCKET PGA 299POS GOLD

Preci-Dip
3,978 -

RFQ

510-87-299-20-001101

Ficha técnica

Bulk 510 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-299-20-091101

510-87-299-20-091101

CONN SOCKET PGA 299POS GOLD

Preci-Dip
3,694 -

RFQ

510-87-299-20-091101

Ficha técnica

Bulk 510 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-085-11-041112

614-87-085-11-041112

CONN SOCKET PGA 85POS GOLD

Preci-Dip
3,738 -

RFQ

614-87-085-11-041112

Ficha técnica

Bulk 614 Active PGA 85 (11 x 11) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-87-640-41-013101

116-87-640-41-013101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,631 -

RFQ

116-87-640-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-300-21-001101

510-87-300-21-001101

CONN SOCKET PGA 300POS GOLD

Preci-Dip
3,316 -

RFQ

510-87-300-21-001101

Ficha técnica

Bulk 510 Active PGA 300 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-648-41-004101

116-83-648-41-004101

CONN IC DIP SOCKET 48POS GOLD

Preci-Dip
3,676 -

RFQ

116-83-648-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-196-14-000101

510-83-196-14-000101

CONN SOCKET PGA 196POS GOLD

Preci-Dip
3,278 -

RFQ

510-83-196-14-000101

Ficha técnica

Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-279-19-081101

510-87-279-19-081101

CONN SOCKET PGA 279POS GOLD

Preci-Dip
2,184 -

RFQ

510-87-279-19-081101

Ficha técnica

Bulk 510 Active PGA 279 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-085-11-002135

546-83-085-11-002135

CONN SOCKET PGA 85POS GOLD

Preci-Dip
3,088 -

RFQ

546-83-085-11-002135

Ficha técnica

Bulk 546 Active PGA 85 (11 x 11) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-085-11-002136

546-83-085-11-002136

CONN SOCKET PGA 85POS GOLD

Preci-Dip
3,349 -

RFQ

546-83-085-11-002136

Ficha técnica

Bulk 546 Active PGA 85 (11 x 11) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-280-19-081101

510-87-280-19-081101

CONN SOCKET PGA 280POS GOLD

Preci-Dip
3,228 -

RFQ

510-87-280-19-081101

Ficha técnica

Bulk 510 Active PGA 280 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-281-19-081101

510-87-281-19-081101

CONN SOCKET PGA 281POS GOLD

Preci-Dip
3,603 -

RFQ

510-87-281-19-081101

Ficha técnica

Bulk 510 Active PGA 281 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-088-13-062112

614-87-088-13-062112

CONN SOCKET PGA 88POS GOLD

Preci-Dip
2,940 -

RFQ

614-87-088-13-062112

Ficha técnica

Bulk 614 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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