Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-87-088-13-081112

614-87-088-13-081112

CONN SOCKET PGA 88POS GOLD

Preci-Dip
3,872 -

RFQ

614-87-088-13-081112

Ficha técnica

Bulk 614 Active PGA 88 (13 x 13) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-87-309-21-001101

510-87-309-21-001101

CONN SOCKET PGA 309POS GOLD

Preci-Dip
2,542 -

RFQ

510-87-309-21-001101

Ficha técnica

Bulk 510 Active PGA 309 (21 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-201-15-041101

510-83-201-15-041101

CONN SOCKET PGA 201POS GOLD

Preci-Dip
3,093 -

RFQ

510-83-201-15-041101

Ficha técnica

Bulk 510 Active PGA 201 (15 x 15) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-87-640-10-002101

299-87-640-10-002101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,696 -

RFQ

299-87-640-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-068-10-061101

550-10-068-10-061101

PGA SOLDER TAIL

Preci-Dip
3,654 -

RFQ

550-10-068-10-061101

Ficha técnica

Bulk 550 Active PGA 68 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-068-11-061101

550-10-068-11-061101

PGA SOLDER TAIL

Preci-Dip
2,479 -

RFQ

550-10-068-11-061101

Ficha técnica

Bulk 550 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-068-11-071101

550-10-068-11-071101

PGA SOLDER TAIL

Preci-Dip
3,431 -

RFQ

550-10-068-11-071101

Ficha técnica

Bulk 550 Active PGA 68 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-207-17-081101

510-83-207-17-081101

CONN SOCKET PGA 207POS GOLD

Preci-Dip
2,077 -

RFQ

510-83-207-17-081101

Ficha técnica

Bulk 510 Active PGA 207 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-650-41-004101

116-83-650-41-004101

CONN IC DIP SOCKET 50POS GOLD

Preci-Dip
3,885 -

RFQ

116-83-650-41-004101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-069-11-001101

550-10-069-11-001101

PGA SOLDER TAIL

Preci-Dip
3,263 -

RFQ

550-10-069-11-001101

Ficha técnica

Bulk 550 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-069-11-061101

550-10-069-11-061101

PGA SOLDER TAIL

Preci-Dip
2,570 -

RFQ

550-10-069-11-061101

Ficha técnica

Bulk 550 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-207-17-082101

510-83-207-17-082101

CONN SOCKET PGA 207POS GOLD

Preci-Dip
2,816 -

RFQ

510-83-207-17-082101

Ficha técnica

Bulk 510 Active PGA 207 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-208-17-081101

510-83-208-17-081101

CONN SOCKET PGA 208POS GOLD

Preci-Dip
2,359 -

RFQ

510-83-208-17-081101

Ficha técnica

Bulk 510 Active PGA 208 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-209-17-001101

510-83-209-17-001101

CONN SOCKET PGA 209POS GOLD

Preci-Dip
3,120 -

RFQ

510-83-209-17-001101

Ficha técnica

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-209-17-062101

510-83-209-17-062101

CONN SOCKET PGA 209POS GOLD

Preci-Dip
3,213 -

RFQ

510-83-209-17-062101

Ficha técnica

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-209-17-063101

510-83-209-17-063101

CONN SOCKET PGA 209POS GOLD

Preci-Dip
2,706 -

RFQ

510-83-209-17-063101

Ficha técnica

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-209-17-081101

510-83-209-17-081101

CONN SOCKET PGA 209POS GOLD

Preci-Dip
3,892 -

RFQ

510-83-209-17-081101

Ficha técnica

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
116-83-640-41-013101

116-83-640-41-013101

CONN IC DIP SOCKET 40POS GOLD

Preci-Dip
3,108 -

RFQ

116-83-640-41-013101

Ficha técnica

Bulk 116 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
299-83-636-10-002101

299-83-636-10-002101

CONN IC DIP SOCKET 36POS GOLD

Preci-Dip
3,926 -

RFQ

299-83-636-10-002101

Ficha técnica

Bulk 299 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-83-210-17-061101

510-83-210-17-061101

CONN SOCKET PGA 210POS GOLD

Preci-Dip
3,168 -

RFQ

510-83-210-17-061101

Ficha técnica

Bulk 510 Active PGA 210 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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