Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
517-83-280-18-101111

517-83-280-18-101111

CONN SOCKET PGA 280POS GOLD

Preci-Dip
3,201 -

RFQ

517-83-280-18-101111

Ficha técnica

Bulk 517 Active PGA 280 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-121-13-061101

550-10-121-13-061101

PGA SOLDER TAIL

Preci-Dip
2,373 -

RFQ

550-10-121-13-061101

Ficha técnica

Bulk 550 Active PGA 121 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-124-13-041101

550-10-124-13-041101

PGA SOLDER TAIL

Preci-Dip
2,208 -

RFQ

550-10-124-13-041101

Ficha técnica

Bulk 550 Active PGA 124 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-132-14-071112

614-83-132-14-071112

CONN SOCKET PGA 132POS GOLD

Preci-Dip
2,812 -

RFQ

614-83-132-14-071112

Ficha técnica

Bulk 614 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-133-14-071112

614-83-133-14-071112

CONN SOCKET PGA 133POS GOLD

Preci-Dip
3,652 -

RFQ

614-83-133-14-071112

Ficha técnica

Bulk 614 Active PGA 133 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-401-19-101111

517-87-401-19-101111

CONN SOCKET PGA 401POS GOLD

Preci-Dip
2,350 -

RFQ

517-87-401-19-101111

Ficha técnica

Bulk 517 Active PGA 401 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-293-18-101111

517-83-293-18-101111

CONN SOCKET PGA 293POS GOLD

Preci-Dip
3,842 -

RFQ

517-83-293-18-101111

Ficha técnica

Bulk 517 Active PGA 293 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-403-19-111111

517-87-403-19-111111

CONN SOCKET PGA 403POS GOLD

Preci-Dip
3,636 -

RFQ

517-87-403-19-111111

Ficha técnica

Bulk 517 Active PGA 403 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-192M16-001148

514-87-192M16-001148

CONN SOCKET BGA 192POS GOLD

Preci-Dip
3,242 -

RFQ

514-87-192M16-001148

Ficha técnica

Bulk 514 Active BGA 192 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-321-19-121154

514-87-321-19-121154

CONN SOCKET PGA 321POS GOLD

Preci-Dip
3,261 -

RFQ

514-87-321-19-121154

Ficha técnica

Bulk 514 Active PGA 321 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-168-17-101112

614-87-168-17-101112

CONN SOCKET PGA 168POS GOLD

Preci-Dip
3,878 -

RFQ

614-87-168-17-101112

Ficha técnica

Bulk 614 Active PGA 168 (17 x 17) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-411-20-111111

517-87-411-20-111111

CONN SOCKET PGA 411POS GOLD

Preci-Dip
2,879 -

RFQ

517-87-411-20-111111

Ficha técnica

Bulk 517 Active PGA 411 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-299-16-091111

517-83-299-16-091111

CONN SOCKET PGA 299POS GOLD

Preci-Dip
3,805 -

RFQ

517-83-299-16-091111

Ficha técnica

Bulk 517 Active PGA 299 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-168-17-101135

546-83-168-17-101135

CONN SOCKET PGA 168POS GOLD

Preci-Dip
3,825 -

RFQ

546-83-168-17-101135

Ficha técnica

Bulk 546 Active PGA 168 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-83-168-17-101136

546-83-168-17-101136

CONN SOCKET PGA 168POS GOLD

Preci-Dip
2,167 -

RFQ

546-83-168-17-101136

Ficha técnica

Bulk 546 Active PGA 168 (17 x 17) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-419-19-111111

517-87-419-19-111111

CONN SOCKET PGA 419POS GOLD

Preci-Dip
3,358 -

RFQ

517-87-419-19-111111

Ficha técnica

Bulk 517 Active PGA 419 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-305-18-101111

517-83-305-18-101111

CONN SOCKET PGA 305POS GOLD

Preci-Dip
2,290 -

RFQ

517-83-305-18-101111

Ficha técnica

Bulk 517 Active PGA 305 (18 x 18) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-304-14-051111

517-83-304-14-051111

CONN SOCKET PGA 304POS GOLD

Preci-Dip
3,498 -

RFQ

517-83-304-14-051111

Ficha técnica

Bulk 517 Active PGA 304 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-420-19-111111

517-87-420-19-111111

CONN SOCKET PGA 420POS GOLD

Preci-Dip
2,408 -

RFQ

517-87-420-19-111111

Ficha técnica

Bulk 517 Active PGA 420 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-175-16-071117

514-83-175-16-071117

CONN SOCKET PGA 175POS GOLD

Preci-Dip
3,546 -

RFQ

514-83-175-16-071117

Ficha técnica

Bulk 514 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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