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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
550-10-145-15-001101PGA SOLDER TAIL Preci-Dip |
3,593 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | PGA | 145 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-87-463-19-101111CONN SOCKET PGA 463POS GOLD Preci-Dip |
2,599 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 463 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-441-21-000101CONN SOCKET PGA 441POS GOLD Preci-Dip |
3,622 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 441 (21 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-83-320-19-131111CONN SOCKET PGA 320POS GOLD Preci-Dip |
2,203 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 320 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-83-321-19-121111CONN SOCKET PGA 321POS GOLD Preci-Dip |
3,987 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 321 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-255M16-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,982 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 255 (16 x 16) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-256M16-000166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
2,390 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 256 (16 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-256M20-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,425 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 256 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
517-87-475-21-121111CONN SOCKET PGA 475POS GOLD Preci-Dip |
2,907 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 475 (21 x 21) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-149-15-063101PGA SOLDER TAIL Preci-Dip |
3,105 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | PGA | 149 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-192-14-001135CONN SOCKET PGA 192POS GOLD Preci-Dip |
3,731 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 192 (14 x 14) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-192-14-001136CONN SOCKET PGA 192POS GOLD Preci-Dip |
2,254 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 192 (14 x 14) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-87-545-17-000111CONN SOCKET PGA 545POS GOLD Preci-Dip |
2,491 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 545 (17 x 17) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-83-361-18-101111CONN SOCKET PGA 361POS GOLD Preci-Dip |
3,982 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 361 (18 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-272M20-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,570 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 272 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
517-87-503-22-131111CONN SOCKET PGA 503POS GOLD Preci-Dip |
2,131 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 503 (22 x 22) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-168-17-101112CONN SOCKET PGA 168POS GOLD Preci-Dip |
3,887 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 168 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-192M16-001148CONN SOCKET BGA 192POS GOLD Preci-Dip |
2,698 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 192 (16 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-83-365-17-091111CONN SOCKET PGA 365POS GOLD Preci-Dip |
3,334 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 365 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-83-365-14-000111CONN SOCKET PGA 365POS GOLD Preci-Dip |
2,578 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 365 (14 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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