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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
550-10-500M30-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
2,945 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-83-352M26-001148CONN SOCKET BGA 352POS GOLD Preci-Dip |
2,656 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 352 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-83-685-19-000111CONN SOCKET PGA 685POS GOLD Preci-Dip |
2,445 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 685 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-325-18-111144CONN SOCKET PGA 325POS GOLD Preci-Dip |
2,257 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 325 (18 x 18) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-504M29-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
2,983 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-352M26-001152BGA SOLDER TAIL Preci-Dip |
3,710 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 352 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-83-391-18-101147CONN SOCKET PGA 391POS GOLD Preci-Dip |
3,084 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 391 (18 x 18) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-356M26-001148CONN SOCKET BGA 356POS GOLD Preci-Dip |
2,200 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 356 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-296-19-131135PGA SOLDER TAIL Preci-Dip |
2,128 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | PGA | 296 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-360M19-001148CONN SOCKET BGA 360POS GOLD Preci-Dip |
3,393 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 360 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-357M19-001152BGA SOLDER TAIL Preci-Dip |
2,056 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 357 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-360M19-001152BGA SOLDER TAIL Preci-Dip |
2,211 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 360 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-87-456M26-001148CONN SOCKET BGA 456POS GOLD Preci-Dip |
3,995 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 456 (26 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-520M31-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,125 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 520 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-87-503-22-131147CONN SOCKET PGA 503POS GOLD Preci-Dip |
3,825 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 503 (22 x 22) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-296-19-131147CONN SOCKET PGA 296POS GOLD Preci-Dip |
3,290 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 296 (19 x 19) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-352M26-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,268 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 352 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-83-403-19-111147CONN SOCKET PGA 403POS GOLD Preci-Dip |
2,848 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 403 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-356M26-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,765 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 356 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-357M19-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,044 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 357 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
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