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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
517-83-529-21-121111CONN SOCKET PGA 529POS GOLD Preci-Dip |
3,755 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 529 (21 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-420M26-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,666 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 420 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-83-325-18-111147CONN SOCKET PGA 325POS GOLD Preci-Dip |
2,546 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 325 (18 x 18) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-83-539-20-101111CONN SOCKET PGA 539POS GOLD Preci-Dip |
3,734 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 539 (20 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-272M20-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,446 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 272 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-87-388M26-001148CONN SOCKET BGA 388POS GOLD Preci-Dip |
2,027 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 388 (26 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-292M20-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,109 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 292 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-432M31-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,634 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
517-83-559-22-131111CONN SOCKET PGA 559POS GOLD Preci-Dip |
3,167 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 559 (22 x 22) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-272M20-001106CONN SOCKET PGA 272POS GOLD Preci-Dip |
2,728 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 272 (20 x 20) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
546-87-403-19-111147CONN SOCKET PGA 403POS GOLD Preci-Dip |
3,041 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 403 (19 x 19) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-80-381-18-101135PGA SOLDER TAIL Preci-Dip |
2,756 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | PGA | 381 (18 x 18) | 0.050 (1.27mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-320-19-131147CONN SOCKET PGA 320POS GOLD Preci-Dip |
3,022 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 320 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-321-19-121147CONN SOCKET PGA 321POS GOLD Preci-Dip |
2,613 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 321 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-83-565-21-111111CONN SOCKET PGA 565POS GOLD Preci-Dip |
2,048 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 565 (21 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-87-400M20-000148CONN SOCKET BGA 400POS GOLD Preci-Dip |
2,310 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 400 (20 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-456M26-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
2,878 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 456 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-87-419-19-111147CONN SOCKET PGA 419POS GOLD Preci-Dip |
3,638 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 419 (19 x 19) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-420-19-111147CONN SOCKET PGA 420POS GOLD Preci-Dip |
2,048 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 420 (19 x 19) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-296-19-131144CONN SOCKET PGA 296POS GOLD Preci-Dip |
3,532 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 296 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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