Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
514-83-257-20-111117

514-83-257-20-111117

CONN SOCKET PGA 257POS GOLD

Preci-Dip
2,426 -

RFQ

514-83-257-20-111117

Ficha técnica

Bulk 514 Active PGA 257 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-447-20-121111

517-83-447-20-121111

CONN SOCKET PGA 447POS GOLD

Preci-Dip
3,979 -

RFQ

517-83-447-20-121111

Ficha técnica

Bulk 517 Active PGA 447 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-357M19-001166

550-10-357M19-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,920 -

RFQ

550-10-357M19-001166

Ficha técnica

Bulk 550 Active BGA 357 (19 x 19) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-83-255M16-001148

514-83-255M16-001148

CONN SOCKET BGA 255POS GOLD

Preci-Dip
2,570 -

RFQ

514-83-255M16-001148

Ficha técnica

Bulk 514 Active BGA 255 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-256M16-000148

514-83-256M16-000148

CONN SOCKET BGA 256POS GOLD

Preci-Dip
2,296 -

RFQ

514-83-256M16-000148

Ficha técnica

Bulk 514 Active BGA 256 (16 x 16) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-83-256M20-001148

514-83-256M20-001148

CONN SOCKET BGA 256POS GOLD

Preci-Dip
2,951 -

RFQ

514-83-256M20-001148

Ficha técnica

Bulk 514 Active BGA 256 (20 x 20) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-356M26-001166

550-10-356M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,749 -

RFQ

550-10-356M26-001166

Ficha técnica

Bulk 550 Active BGA 356 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-255M16-001152

550-10-255M16-001152

BGA SOLDER TAIL

Preci-Dip
3,016 -

RFQ

550-10-255M16-001152

Ficha técnica

Bulk 550 Active BGA 255 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-256M16-000152

550-10-256M16-000152

BGA SOLDER TAIL

Preci-Dip
2,919 -

RFQ

550-10-256M16-000152

Ficha técnica

Bulk 550 Active BGA 256 (16 x 16) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
550-10-256M20-001152

550-10-256M20-001152

BGA SOLDER TAIL

Preci-Dip
3,798 -

RFQ

550-10-256M20-001152

Ficha técnica

Bulk 550 Active BGA 256 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
614-83-225-17-061112

614-83-225-17-061112

CONN SOCKET PGA 225POS GOLD

Preci-Dip
2,231 -

RFQ

614-83-225-17-061112

Ficha técnica

Bulk 614 Active PGA 225 (17 x 17) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-320-19-131147

546-87-320-19-131147

CONN SOCKET PGA 320POS GOLD

Preci-Dip
3,761 -

RFQ

546-87-320-19-131147

Ficha técnica

Bulk 546 Active PGA 320 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-463-19-101111

517-83-463-19-101111

CONN SOCKET PGA 463POS GOLD

Preci-Dip
3,049 -

RFQ

517-83-463-19-101111

Ficha técnica

Bulk 517 Active PGA 463 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-321-19-121147

546-87-321-19-121147

CONN SOCKET PGA 321POS GOLD

Preci-Dip
3,697 -

RFQ

546-87-321-19-121147

Ficha técnica

Bulk 546 Active PGA 321 (19 x 19) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-685-19-000111

517-87-685-19-000111

CONN SOCKET PGA 685POS GOLD

Preci-Dip
2,869 -

RFQ

517-87-685-19-000111

Ficha técnica

Bulk 517 Active PGA 685 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-475-21-121111

517-83-475-21-121111

CONN SOCKET PGA 475POS GOLD

Preci-Dip
3,644 -

RFQ

517-83-475-21-121111

Ficha técnica

Bulk 517 Active PGA 475 (21 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
550-10-225-18-091101

550-10-225-18-091101

PGA SOLDER TAIL

Preci-Dip
2,769 -

RFQ

550-10-225-18-091101

Ficha técnica

Bulk 550 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-364-17-091147

546-87-364-17-091147

CONN SOCKET PGA 364POS GOLD

Preci-Dip
3,927 -

RFQ

546-87-364-17-091147

Ficha técnica

Bulk 546 Active PGA 364 (17 x 17) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-365-14-000147

546-87-365-14-000147

CONN SOCKET PGA 365POS GOLD

Preci-Dip
3,771 -

RFQ

546-87-365-14-000147

Ficha técnica

Bulk 546 Active PGA 365 (14 x 14) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
546-87-365-17-091147

546-87-365-17-091147

CONN SOCKET PGA 365POS GOLD

Preci-Dip
2,027 -

RFQ

546-87-365-17-091147

Ficha técnica

Bulk 546 Active PGA 365 (17 x 17) 0.050 (1.27mm) Gold Flash Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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