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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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514-83-478M26-131148CONN SOCKET BGA 478POS GOLD Preci-Dip |
3,036 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 478 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-87-600M35-001148CONN SOCKET BGA 600POS GOLD Preci-Dip |
3,064 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 600 (35 x 35) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-480M29-001148CONN SOCKET BGA 480POS GOLD Preci-Dip |
2,690 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 480 (29 x 29) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-478M26-131152BGA SOLDER TAIL Preci-Dip |
2,256 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-480M29-001152BGA SOLDER TAIL Preci-Dip |
3,285 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-456M26-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
2,546 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 456 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-420M26-001106CONN SOCKET PGA 420POS GOLD Preci-Dip |
2,203 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 420 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-432M31-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,280 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-432M31-001105CONN SOCKET PGA 432POS GOLD Preci-Dip |
3,008 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
546-83-528-21-121147CONN SOCKET PGA 528POS GOLD Preci-Dip |
2,747 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 528 (21 x 21) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-529-21-121147CONN SOCKET PGA 529POS GOLD Preci-Dip |
2,709 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 529 (21 x 21) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-545-17-000147CONN SOCKET PGA 545POS GOLD Preci-Dip |
3,303 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 545 (17 x 17) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-500M30-001148CONN SOCKET BGA 500POS GOLD Preci-Dip |
2,107 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 500 (30 x 30) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-432M31-001106CONN SOCKET PGA 432POS GOLD Preci-Dip |
2,922 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
514-83-504M29-001148CONN SOCKET BGA 504POS GOLD Preci-Dip |
2,726 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 504 (29 x 29) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-500M30-001152BGA SOLDER TAIL Preci-Dip |
2,465 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-504M29-001152BGA SOLDER TAIL Preci-Dip |
2,147 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-478M26-131101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,339 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-480M29-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,245 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-456M26-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,258 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 456 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
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