Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
27-0501-30

27-0501-30

CONN SOCKET SIP 27POS TIN

Aries Electronics
3,574 -

RFQ

27-0501-30

Ficha técnica

Bulk 501 Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-6503-21

18-6503-21

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
3,535 -

RFQ

18-6503-21

Ficha técnica

Bulk 503 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-201

32-6508-201

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,953 -

RFQ

32-6508-201

Ficha técnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-301

32-6508-301

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,159 -

RFQ

32-6508-301

Ficha técnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-7445-10

24-7445-10

CONN SOCKET SIP 24POS TIN

Aries Electronics
3,569 -

RFQ

24-7445-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 24 (1 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-7500-10

24-7500-10

CONN SOCKET SIP 24POS TIN

Aries Electronics
2,804 -

RFQ

24-7500-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 24 (1 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6518-01

32-6518-01

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
3,313 -

RFQ

32-6518-01

Ficha técnica

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
84-PGM10003-10

84-PGM10003-10

CONN SOCKET PGA GOLD

Aries Electronics
2,153 -

RFQ

84-PGM10003-10

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
84-PGM11009-10

84-PGM11009-10

CONN SOCKET PGA GOLD

Aries Electronics
2,825 -

RFQ

84-PGM11009-10

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
84-PGM11010-10

84-PGM11010-10

CONN SOCKET PGA GOLD

Aries Electronics
3,667 -

RFQ

84-PGM11010-10

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
84-PGM13053-10

84-PGM13053-10

CONN SOCKET PGA GOLD

Aries Electronics
3,858 -

RFQ

84-PGM13053-10

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-6810-90

18-6810-90

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics
2,396 -

RFQ

18-6810-90

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
22-81150-610C

22-81150-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,347 -

RFQ

22-81150-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-81250-310C

22-81250-310C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,549 -

RFQ

22-81250-310C

Ficha técnica

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-81250-610C

22-81250-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
3,704 -

RFQ

22-81250-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-8500-610C

22-8500-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,874 -

RFQ

22-8500-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-8600-610C

22-8600-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
3,256 -

RFQ

22-8600-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-8850-610C

22-8850-610C

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
3,660 -

RFQ

22-8850-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
85-PGM11007-10

85-PGM11007-10

CONN SOCKET PGA GOLD

Aries Electronics
3,436 -

RFQ

85-PGM11007-10

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
64-9518-10M

64-9518-10M

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
3,927 -

RFQ

64-9518-10M

Ficha técnica

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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