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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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39-0508-20CONN SOCKET SIP 39POS GOLD Aries Electronics |
2,218 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | SIP | 39 (1 x 39) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
39-0508-30CONN SOCKET SIP 39POS GOLD Aries Electronics |
2,631 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | SIP | 39 (1 x 39) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
30-9513-11HCONN IC DIP SOCKET 30POS GOLD Aries Electronics |
2,040 | - |
RFQ |
Ficha técnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
32-6501-21CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
2,695 | - |
RFQ |
Ficha técnica |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
32-6501-31CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
2,696 | - |
RFQ |
Ficha técnica |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
48-6518-11HCONN IC DIP SOCKET 48POS GOLD Aries Electronics |
2,625 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-6551-11CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics |
2,426 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
24-3554-11CONN IC DIP SOCKET ZIF 24POS GLD Aries Electronics |
3,587 | - |
RFQ |
Ficha técnica |
Bulk | 55 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
34-71050-10CONN SOCKET SIP 34POS TIN Aries Electronics |
2,177 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-71130-10CONN SOCKET SIP 34POS TIN Aries Electronics |
2,873 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-71250-10CONN SOCKET SIP 34POS TIN Aries Electronics |
3,835 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-7335-10CONN SOCKET SIP 34POS TIN Aries Electronics |
2,557 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-7350-10CONN SOCKET SIP 34POS TIN Aries Electronics |
3,279 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-7394-10CONN SOCKET SIP 34POS TIN Aries Electronics |
2,722 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-7400-10CONN SOCKET SIP 34POS TIN Aries Electronics |
3,773 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-7435-10CONN SOCKET SIP 34POS TIN Aries Electronics |
2,701 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-7450-10CONN SOCKET SIP 34POS TIN Aries Electronics |
2,185 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-7453-10CONN SOCKET SIP 34POS TIN Aries Electronics |
2,824 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-7500-10CONN SOCKET SIP 34POS TIN Aries Electronics |
3,563 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-7550-10CONN SOCKET SIP 34POS TIN Aries Electronics |
3,344 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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