Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
24-3552-11

24-3552-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics
2,021 -

RFQ

24-3552-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-3553-11

24-3553-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics
2,305 -

RFQ

24-3553-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
24-6552-11

24-6552-11

CONN IC DIP SOCKET ZIF 24POS GLD

Aries Electronics
3,460 -

RFQ

24-6552-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
21-0508-21

21-0508-21

CONN SOCKET SIP 21POS GOLD

Aries Electronics
2,533 -

RFQ

21-0508-21

Ficha técnica

Bulk 508 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
21-0508-31

21-0508-31

CONN SOCKET SIP 21POS GOLD

Aries Electronics
3,487 -

RFQ

21-0508-31

Ficha técnica

Bulk 508 Active SIP 21 (1 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
16-C195-21

16-C195-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
3,836 -

RFQ

16-C195-21

Ficha técnica

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C195-31

16-C195-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,721 -

RFQ

16-C195-31

Ficha técnica

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-21

16-C280-21

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,094 -

RFQ

16-C280-21

Ficha técnica

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-C280-31

16-C280-31

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics
2,309 -

RFQ

16-C280-31

Ficha técnica

Bulk EJECT-A-DIP™ Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6823-90

28-6823-90

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,565 -

RFQ

28-6823-90

Ficha técnica

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
30-0501-20

30-0501-20

CONN SOCKET SIP 30POS TIN

Aries Electronics
2,418 -

RFQ

30-0501-20

Ficha técnica

Bulk 501 Active SIP 30 (1 x 30) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-0501-30

30-0501-30

CONN SOCKET SIP 30POS TIN

Aries Electronics
2,391 -

RFQ

30-0501-30

Ficha técnica

Bulk 501 Active SIP 30 (1 x 30) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
02-0518-00

02-0518-00

CONN SOCKET SIP 2POS GOLD

Aries Electronics
2,704 -

RFQ

02-0518-00

Ficha técnica

Bulk 518 Active SIP 2 (1 x 2) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-202

32-6508-202

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,346 -

RFQ

32-6508-202

Ficha técnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6508-302

32-6508-302

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
3,620 -

RFQ

32-6508-302

Ficha técnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-6501-21

30-6501-21

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,010 -

RFQ

30-6501-21

Ficha técnica

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-6501-31

30-6501-31

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,737 -

RFQ

30-6501-31

Ficha técnica

Bulk 501 Active DIP, 0.6 (15.24mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
169-PGM13001-10

169-PGM13001-10

CONN SOCKET PGA GOLD 169POS

Aries Electronics
2,690 -

RFQ

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6511-11

40-6511-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,116 -

RFQ

40-6511-11

Ficha técnica

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
27-7500-10

27-7500-10

CONN SOCKET SIP 27POS TIN

Aries Electronics
2,393 -

RFQ

27-7500-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 27 (1 x 27) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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