Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-43-328-41-001000

614-43-328-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,876 -

RFQ

614-43-328-41-001000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-428-41-001000

614-43-428-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,359 -

RFQ

614-43-428-41-001000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-628-41-001000

614-43-628-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,168 -

RFQ

614-43-628-41-001000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-642-41-008000

116-93-642-41-008000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
3,761 -

RFQ

116-93-642-41-008000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-642-41-008000

116-43-642-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,303 -

RFQ

116-43-642-41-008000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-650-41-006000

116-47-650-41-006000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
2,233 -

RFQ

116-47-650-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-93-132-31-007000

714-93-132-31-007000

SOCKET CARRIER SIP 32POS

Mill-Max Manufacturing Corp.
2,254 -

RFQ

714-93-132-31-007000

Ficha técnica

Tube 714 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-650-41-770000

104-11-650-41-770000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,571 -

RFQ

104-11-650-41-770000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-642-31-002000

614-43-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,093 -

RFQ

614-43-642-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-642-31-002000

614-93-642-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,753 -

RFQ

614-93-642-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
24-81000-610C

24-81000-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,485 -

RFQ

24-81000-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-81125-610C

24-81125-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,166 -

RFQ

24-81125-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-81150-610C

24-81150-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,373 -

RFQ

24-81150-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-81250-610C

24-81250-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,370 -

RFQ

24-81250-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8250-610C

24-8250-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,732 -

RFQ

24-8250-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8312-610C

24-8312-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,548 -

RFQ

24-8312-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8370-610C

24-8370-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,542 -

RFQ

24-8370-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8500-610C

24-8500-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
3,070 -

RFQ

24-8500-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8550-610C

24-8550-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,720 -

RFQ

24-8550-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-8580-610C

24-8580-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics
2,393 -

RFQ

24-8580-610C

Ficha técnica

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 495496497498499500501502...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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