Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
39-0508-20

39-0508-20

CONN SOCKET SIP 39POS GOLD

Aries Electronics
2,218 -

RFQ

39-0508-20

Ficha técnica

Bulk 508 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
614-91-432-31-002000

614-91-432-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,207 -

RFQ

614-91-432-31-002000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-632-31-002000

614-91-632-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,382 -

RFQ

614-91-632-31-002000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-11-964-41-001000

110-11-964-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,289 -

RFQ

110-11-964-41-001000

Ficha técnica

Tube 110 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-648-41-001000

123-91-648-41-001000

SOCKET IC OPEN 3 LVL .600 48POS

Mill-Max Manufacturing Corp.
3,300 -

RFQ

Tube 123 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
39-0508-30

39-0508-30

CONN SOCKET SIP 39POS GOLD

Aries Electronics
2,631 -

RFQ

39-0508-30

Ficha técnica

Bulk 508 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6
116-93-652-41-006000

116-93-652-41-006000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
3,257 -

RFQ

116-93-652-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-652-41-006000

116-43-652-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,389 -

RFQ

116-43-652-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-648-31-007000

614-41-648-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,176 -

RFQ

614-41-648-31-007000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-648-31-007000

614-91-648-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,714 -

RFQ

614-91-648-31-007000

Ficha técnica

Tube 614 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
30-9513-11H

30-9513-11H

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
2,040 -

RFQ

30-9513-11H

Ficha técnica

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-47-642-41-007000

116-47-642-41-007000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,060 -

RFQ

116-47-642-41-007000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
APA-628-G-M

APA-628-G-M

ADAPTER PLUG

Samtec Inc.
3,181 -

RFQ

Tube APA Active - 28 (2 x 14) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
116-41-636-41-007000

116-41-636-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,724 -

RFQ

116-41-636-41-007000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-636-41-007000

116-91-636-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,076 -

RFQ

116-91-636-41-007000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-124-13-041101

550-10-124-13-041101

PGA SOLDER TAIL

Preci-Dip
2,208 -

RFQ

550-10-124-13-041101

Ficha técnica

Bulk 550 Active PGA 124 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-83-132-14-071112

614-83-132-14-071112

CONN SOCKET PGA 132POS GOLD

Preci-Dip
2,812 -

RFQ

614-83-132-14-071112

Ficha técnica

Bulk 614 Active PGA 132 (14 x 14) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
114-47-952-41-117000

114-47-952-41-117000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,436 -

RFQ

114-47-952-41-117000

Ficha técnica

Tube 114 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-13-328-41-001000

612-13-328-41-001000

SOCKET CARRIER SLDRTL .300 28POS

Mill-Max Manufacturing Corp.
2,745 -

RFQ

612-13-328-41-001000

Ficha técnica

Tube 612 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-13-428-41-001000

612-13-428-41-001000

SOCKET CARRIER SLDRTL .400 28POS

Mill-Max Manufacturing Corp.
3,415 -

RFQ

612-13-428-41-001000

Ficha técnica

Tube 612 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 497498499500501502503504...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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