Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
605-43-652-11-480000

605-43-652-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,185 -

RFQ

605-43-652-11-480000

Ficha técnica

Tube 605 Active DIP, 0.6 (15.24mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-950-41-780000

104-11-950-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,398 -

RFQ

104-11-950-41-780000

Ficha técnica

Tube 104 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-624-41-801000

122-13-624-41-801000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,434 -

RFQ

122-13-624-41-801000

Ficha técnica

Tube 122 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
415-13-264-41-001000

415-13-264-41-001000

SOCKET DUAL INLINE LOW PRO 64POS

Mill-Max Manufacturing Corp.
3,976 -

RFQ

415-13-264-41-001000

Ficha técnica

Tube 415 Active DIP, 0.1 (2.54mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
322-13-132-41-001000

322-13-132-41-001000

SOCKET 2 LEVEL WRAPOST SIP 32POS

Mill-Max Manufacturing Corp.
2,576 -

RFQ

322-13-132-41-001000

Ficha técnica

Tube 322 Active SIP 32 (1 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-648-41-780000

104-13-648-41-780000

CONN IC DIP SOCKET 48POS GOLD

Mill-Max Manufacturing Corp.
2,954 -

RFQ

104-13-648-41-780000

Ficha técnica

Tube 104 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
40-C182-11H

40-C182-11H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,042 -

RFQ

40-C182-11H

Ficha técnica

Bulk EJECT-A-DIP™ Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
127-93-642-41-003000

127-93-642-41-003000

CONN IC DIP SOCKET 42POS GOLD

Mill-Max Manufacturing Corp.
2,348 -

RFQ

127-93-642-41-003000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-642-41-003000

127-43-642-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,615 -

RFQ

127-43-642-41-003000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-43-640-41-004000

612-43-640-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,032 -

RFQ

612-43-640-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-93-640-41-004000

612-93-640-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,314 -

RFQ

612-93-640-41-004000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-41-650-41-001000

116-41-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,475 -

RFQ

116-41-650-41-001000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-91-650-41-001000

116-91-650-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,433 -

RFQ

116-91-650-41-001000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-950-41-001000

612-41-950-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,739 -

RFQ

612-41-950-41-001000

Ficha técnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-950-41-001000

612-91-950-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,395 -

RFQ

612-91-950-41-001000

Ficha técnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-87-175-16-072112

614-87-175-16-072112

CONN SOCKET PGA 175POS GOLD

Preci-Dip
3,760 -

RFQ

614-87-175-16-072112

Ficha técnica

Bulk 614 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-87-428-19-101111

517-87-428-19-101111

CONN SOCKET PGA 428POS GOLD

Preci-Dip
2,616 -

RFQ

517-87-428-19-101111

Ficha técnica

Bulk 517 Active PGA 428 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
29-71250-10

29-71250-10

CONN SOCKET SIP 29POS TIN

Aries Electronics
3,798 -

RFQ

29-71250-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 29 (1 x 29) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
29-7600-10

29-7600-10

CONN SOCKET SIP 29POS TIN

Aries Electronics
3,142 -

RFQ

29-7600-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 29 (1 x 29) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
29-7625-10

29-7625-10

CONN SOCKET SIP 29POS TIN

Aries Electronics
2,318 -

RFQ

29-7625-10

Ficha técnica

Bulk 700 Elevator Strip-Line™ Active SIP 29 (1 x 29) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 527528529530531532533534...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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