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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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126-43-636-41-002000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,736 | - |
RFQ |
Ficha técnica |
Tube | 126 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
18-0511-11CONN SOCKET SIP 18POS GOLD Aries Electronics |
2,423 | - |
RFQ |
Ficha técnica |
Bulk | 511 | Active | SIP | 18 (1 x 18) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
614-83-144-15-081112CONN SOCKET PGA 144POS GOLD Preci-Dip |
3,906 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 144 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
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605-93-952-11-480000SOCKET CARRIER LOWPRO .900 52POS Mill-Max Manufacturing Corp. |
2,262 | - |
RFQ |
Ficha técnica |
Tube | 605 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
605-43-952-11-480000SKT CARRIER LOWPRO Mill-Max Manufacturing Corp. |
3,593 | - |
RFQ |
Ficha técnica |
Tube | 605 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
30-7360-10CONN SOCKET SIP 30POS TIN Aries Electronics |
3,179 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7365-10CONN SOCKET SIP 30POS TIN Aries Electronics |
3,117 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7374-10CONN SOCKET SIP 30POS TIN Aries Electronics |
2,045 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7375-10CONN SOCKET SIP 30POS TIN Aries Electronics |
2,875 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7400-10CONN SOCKET SIP 30POS TIN Aries Electronics |
2,241 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7430-10CONN SOCKET SIP 30POS TIN Aries Electronics |
2,581 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7435-10CONN SOCKET SIP 30POS TIN Aries Electronics |
2,179 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7437-10CONN SOCKET SIP 30POS TIN Aries Electronics |
3,154 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7440-10CONN SOCKET SIP 30POS TIN Aries Electronics |
3,235 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7472-10CONN SOCKET SIP 30POS TIN Aries Electronics |
2,709 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7920-10CONN SOCKET SIP 30POS TIN Aries Electronics |
3,844 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-7970-10CONN SOCKET SIP 30POS TIN Aries Electronics |
3,090 | - |
RFQ |
Ficha técnica |
Bulk | 700 Elevator Strip-Line™ | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Elevated | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-43-310-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,919 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-310-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,327 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
123-93-650-41-001000CONN IC DIP SOCKET 50POS GOLD Mill-Max Manufacturing Corp. |
3,876 | - |
RFQ |
Ficha técnica |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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