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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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612-43-950-41-001000SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp. |
2,239 | - |
RFQ |
Ficha técnica |
Tube | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-44-320-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,188 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
117-41-668-41-105000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,221 | - |
RFQ |
Ficha técnica |
Tube | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 68 (2 x 34) | 0.070 (1.78mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
614-41-964-31-007000SKT CARRIER PGA Mill-Max Manufacturing Corp. |
2,540 | - |
RFQ |
Ficha técnica |
Tube | 614 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
614-91-964-31-007000SKT CARRIER PGA Mill-Max Manufacturing Corp. |
2,038 | - |
RFQ |
Ficha técnica |
Tube | 614 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
550-10-144-12-000101PGA SOLDER TAIL Preci-Dip |
2,568 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | PGA | 144 (12 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-144-15-081101PGA SOLDER TAIL Preci-Dip |
2,728 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | PGA | 144 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
3-1437508-6CONN TRANSIST TO-5 8POS GOLD TE Connectivity AMP Connectors |
3,937 | - |
RFQ |
Ficha técnica |
Bulk,Box | 8058 | Obsolete | Transistor, TO-5 | 8 (Round) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Brass | Polytetrafluoroethylene (PTFE) |
|
|
127-93-648-41-003000CONN IC DIP SOCKET 48POS GOLD Mill-Max Manufacturing Corp. |
3,502 | - |
RFQ |
Ficha técnica |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-43-648-41-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,697 | - |
RFQ |
Ficha técnica |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-93-448-41-003000CONN IC DIP SOCKET 48POS GOLD Mill-Max Manufacturing Corp. |
3,978 | - |
RFQ |
Ficha técnica |
Tube | 127 | Active | DIP, 0.4 (10.16mm) Row Spacing | 48 (2 x 24) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-43-448-41-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,800 | - |
RFQ |
Ficha técnica |
Tube | 127 | Active | DIP, 0.4 (10.16mm) Row Spacing | 48 (2 x 24) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
27-0508-21CONN SOCKET SIP 27POS GOLD Aries Electronics |
2,064 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | SIP | 27 (1 x 27) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
27-0508-31CONN SOCKET SIP 27POS GOLD Aries Electronics |
3,921 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | SIP | 27 (1 x 27) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
612-43-650-41-003000SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp. |
3,414 | - |
RFQ |
Ficha técnica |
Tube | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-93-650-41-003000SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp. |
3,305 | - |
RFQ |
Ficha técnica |
Tube | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-43-306-61-105000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,285 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-306-61-105000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,510 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
714-93-164-41-001000SOCKET CARRIER SIP 64POS Mill-Max Manufacturing Corp. |
2,696 | - |
RFQ |
Ficha técnica |
Tube | 714 | Active | SIP | 64 (1 x 64) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-44-318-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,948 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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