Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-41-322-61-001000

110-41-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,655 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-41-422-61-001000

110-41-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,428 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-91-322-61-001000

110-91-322-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,177 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-91-422-61-001000

110-91-422-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,599 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-308-61-003000

116-43-308-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,465 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-308-61-003000

116-93-308-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,530 -

RFQ

Tube * Active - - - - - - - - - - - - - -
123-13-328-41-801000

123-13-328-41-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,252 -

RFQ

123-13-328-41-801000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-964-41-001000

614-41-964-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,671 -

RFQ

614-41-964-41-001000

Ficha técnica

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-964-41-001000

614-91-964-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,601 -

RFQ

614-91-964-41-001000

Ficha técnica

Tube 614 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-640-41-003000

126-93-640-41-003000

CONN IC DIP SOCKET 40POS GOLD

Mill-Max Manufacturing Corp.
2,990 -

RFQ

126-93-640-41-003000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-640-41-003000

126-43-640-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,149 -

RFQ

126-43-640-41-003000

Ficha técnica

Tube 126 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
192-PGM17025-10

192-PGM17025-10

CONN SOCKET PGA GOLD

Aries Electronics
3,774 -

RFQ

192-PGM17025-10

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-13-642-41-001000

612-13-642-41-001000

SOCKET CARRIER SLDRTL .600 42POS

Mill-Max Manufacturing Corp.
2,421 -

RFQ

612-13-642-41-001000

Ficha técnica

Tube 612 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-428-61-001000

110-44-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,784 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-428-61-001000

110-99-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,657 -

RFQ

Tube * Active - - - - - - - - - - - - - -
26-0501-21

26-0501-21

CONN SOCKET SIP 26POS GOLD

Aries Electronics
2,932 -

RFQ

26-0501-21

Ficha técnica

Bulk 501 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
26-0501-31

26-0501-31

CONN SOCKET SIP 26POS GOLD

Aries Electronics
2,691 -

RFQ

26-0501-31

Ficha técnica

Bulk 501 Active SIP 26 (1 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-210-61-007000

116-43-210-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,657 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-210-61-007000

116-93-210-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,215 -

RFQ

Tube * Active - - - - - - - - - - - - - -
546-83-183-14-091147

546-83-183-14-091147

CONN SOCKET PGA 183POS GOLD

Preci-Dip
2,101 -

RFQ

546-83-183-14-091147

Ficha técnica

Bulk 546 Active PGA 183 (14 x 14) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Total 21991 Record«Prev1... 553554555556557558559560...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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