Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
116-93-316-41-008000

116-93-316-41-008000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
2,766 -

RFQ

116-93-316-41-008000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-316-41-008000

116-43-316-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,847 -

RFQ

116-43-316-41-008000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-41-642-41-001000

111-41-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,937 -

RFQ

111-41-642-41-001000

Ficha técnica

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-91-642-41-001000

111-91-642-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,145 -

RFQ

111-91-642-41-001000

Ficha técnica

Tube 111 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-316-31-002000

614-43-316-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,914 -

RFQ

614-43-316-31-002000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-316-31-002000

614-93-316-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,135 -

RFQ

614-93-316-31-002000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-93-428-41-003000

115-93-428-41-003000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,468 -

RFQ

115-93-428-41-003000

Ficha técnica

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-428-41-003000

115-43-428-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,585 -

RFQ

115-43-428-41-003000

Ficha técnica

Tube 115 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-320-41-780000

104-11-320-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,518 -

RFQ

104-11-320-41-780000

Ficha técnica

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-11-420-41-780000

104-11-420-41-780000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,837 -

RFQ

104-11-420-41-780000

Ficha técnica

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-640-41-117000

114-41-640-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,631 -

RFQ

114-41-640-41-117000

Ficha técnica

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-640-41-117000

114-91-640-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,643 -

RFQ

114-91-640-41-117000

Ficha técnica

Tube 114 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-314-41-001000

116-93-314-41-001000

CONN IC DIP SOCKET 14POS GOLD

Mill-Max Manufacturing Corp.
3,324 -

RFQ

116-93-314-41-001000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-314-41-001000

116-43-314-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,689 -

RFQ

116-43-314-41-001000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-93-120-31-007000

714-93-120-31-007000

SOCKET CARRIER SIP 20POS

Mill-Max Manufacturing Corp.
2,474 -

RFQ

714-93-120-31-007000

Ficha técnica

Tube 714 Active SIP 20 (1 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-318-11-480000

605-41-318-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
3,500 -

RFQ

605-41-318-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-91-318-11-480000

605-91-318-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,233 -

RFQ

605-91-318-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-320-31-002000

614-41-320-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,662 -

RFQ

614-41-320-31-002000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-420-31-002000

614-41-420-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,614 -

RFQ

614-41-420-31-002000

Ficha técnica

Tube 614 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-320-31-002000

614-91-320-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,082 -

RFQ

614-91-320-31-002000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 114115116117118119120121...608Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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