Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
614-43-318-31-018000

614-43-318-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,552 -

RFQ

614-43-318-31-018000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-324-41-006000

116-93-324-41-006000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,186 -

RFQ

116-93-324-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-424-41-006000

116-93-424-41-006000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
3,215 -

RFQ

116-93-424-41-006000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-624-41-006000

116-93-624-41-006000

CONN IC DIP SOCKET 24POS GOLD

Mill-Max Manufacturing Corp.
2,520 -

RFQ

116-93-624-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-324-41-006000

116-43-324-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,955 -

RFQ

116-43-324-41-006000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-424-41-006000

116-43-424-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,213 -

RFQ

116-43-424-41-006000

Ficha técnica

Tube 116 Active DIP, 0.4 (10.16mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-624-41-006000

116-43-624-41-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,199 -

RFQ

116-43-624-41-006000

Ficha técnica

Tube 116 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-93-316-41-002000

127-93-316-41-002000

CONN IC DIP SOCKET 16POS GOLD

Mill-Max Manufacturing Corp.
2,356 -

RFQ

127-93-316-41-002000

Ficha técnica

Tube 127 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-43-316-41-002000

127-43-316-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,186 -

RFQ

127-43-316-41-002000

Ficha técnica

Tube 127 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-11-632-41-001000

210-11-632-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,858 -

RFQ

210-11-632-41-001000

Ficha técnica

Tube 210 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
714-43-252-31-018000

714-43-252-31-018000

CONN IC DIP SOCKET 52POS GOLD

Mill-Max Manufacturing Corp.
2,736 -

RFQ

714-43-252-31-018000

Ficha técnica

Bulk 714 Active DIP, 0.1 (2.54mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100 (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-314-41-002000

124-41-314-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,104 -

RFQ

124-41-314-41-002000

Ficha técnica

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-91-314-41-002000

124-91-314-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,312 -

RFQ

124-91-314-41-002000

Ficha técnica

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-41-430-41-005000

117-41-430-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,249 -

RFQ

117-41-430-41-005000

Ficha técnica

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
117-91-430-41-005000

117-91-430-41-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,307 -

RFQ

117-91-430-41-005000

Ficha técnica

Tube 117 Active DIP, 0.4 (10.16mm) Row Spacing 30 (2 x 15) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
104-13-320-41-770000

104-13-320-41-770000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,789 -

RFQ

104-13-320-41-770000

Ficha técnica

Tube 104 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
104-13-420-41-770000

104-13-420-41-770000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
2,022 -

RFQ

104-13-420-41-770000

Ficha técnica

Tube 104 Active DIP, 0.4 (10.16mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Thermoplastic
127-41-316-41-003000

127-41-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,746 -

RFQ

127-41-316-41-003000

Ficha técnica

Tube 127 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-91-316-41-003000

127-91-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,661 -

RFQ

127-91-316-41-003000

Ficha técnica

Tube 127 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-41-210-41-002000

124-41-210-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,070 -

RFQ

124-41-210-41-002000

Ficha técnica

Tube 124 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 121122123124125126127128...608Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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