Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
124-91-210-41-002000

124-91-210-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,366 -

RFQ

124-91-210-41-002000

Ficha técnica

Tube 124 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-650-41-003000

115-44-650-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,000 -

RFQ

115-44-650-41-003000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-93-432-41-001000

111-93-432-41-001000

CONN IC DIP SOCKET 32POS GOLD

Mill-Max Manufacturing Corp.
2,142 -

RFQ

111-93-432-41-001000

Ficha técnica

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
111-43-432-41-001000

111-43-432-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,708 -

RFQ

111-43-432-41-001000

Ficha técnica

Tube 111 Active DIP, 0.4 (10.16mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-328-41-105000

110-93-328-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,882 -

RFQ

110-93-328-41-105000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-428-41-105000

110-93-428-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
2,077 -

RFQ

110-93-428-41-105000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-628-41-105000

110-93-628-41-105000

CONN IC DIP SOCKET 28POS GOLD

Mill-Max Manufacturing Corp.
3,738 -

RFQ

110-93-628-41-105000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-328-41-105000

110-43-328-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,461 -

RFQ

110-43-328-41-105000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-428-41-105000

110-43-428-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,091 -

RFQ

110-43-428-41-105000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-628-41-105000

110-43-628-41-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,071 -

RFQ

110-43-628-41-105000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-318-31-007000

614-93-318-31-007000

SOCKET CARRIER LOWPRO .300 18POS

Mill-Max Manufacturing Corp.
3,081 -

RFQ

614-93-318-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-318-31-007000

614-43-318-31-007000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,191 -

RFQ

614-43-318-31-007000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-322-11-480000

605-41-322-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,715 -

RFQ

605-41-322-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-41-422-11-480000

605-41-422-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,002 -

RFQ

605-41-422-11-480000

Ficha técnica

Tube 605 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-648-41-003000

115-47-648-41-003000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
3,805 -

RFQ

115-47-648-41-003000

Ficha técnica

Tube 115 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-322-41-001000

123-91-322-41-001000

SOCKET IC OPEN 3 LVL .300 22POS

Mill-Max Manufacturing Corp.
2,180 -

RFQ

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-422-41-001000

123-91-422-41-001000

SOCKET IC OPEN 3 LVL .400 22POS

Mill-Max Manufacturing Corp.
3,487 -

RFQ

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-322-41-001000

123-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,895 -

RFQ

123-41-322-41-001000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-422-41-001000

123-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,015 -

RFQ

123-41-422-41-001000

Ficha técnica

Tube 123 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-47-642-41-105000

110-47-642-41-105000

STANDRD SOLDRTL

Mill-Max Manufacturing Corp.
3,391 -

RFQ

110-47-642-41-105000

Ficha técnica

Tube 110 Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 122123124125126127128129...608Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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