Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-41-422-41-001000

110-41-422-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,975 -

RFQ

110-41-422-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-210-31-002000

614-43-210-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,033 -

RFQ

614-43-210-31-002000

Ficha técnica

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-210-31-002000

614-93-210-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,238 -

RFQ

614-93-210-31-002000

Ficha técnica

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-310-31-012000

614-41-310-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,093 -

RFQ

614-41-310-31-012000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-310-31-012000

614-91-310-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,749 -

RFQ

614-91-310-31-012000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-44-318-41-003000

115-44-318-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,466 -

RFQ

115-44-318-41-003000

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-93-308-41-105000

110-93-308-41-105000

CONN IC DIP SOCKET 8POS GOLD

Mill-Max Manufacturing Corp.
3,085 -

RFQ

110-93-308-41-105000

Ficha técnica

Tube 110 Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
317-91-106-41-005000

317-91-106-41-005000

CONN SKT SNG

Mill-Max Manufacturing Corp.
3,024 -

RFQ

317-91-106-41-005000

Ficha técnica

Bulk 317 Active SIP 6 (1 x 6) 0.070 (1.78mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-306-31-002000

614-41-306-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,868 -

RFQ

614-41-306-31-002000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-306-31-002000

614-91-306-31-002000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,267 -

RFQ

614-91-306-31-002000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-306-41-008000

116-93-306-41-008000

CONN IC DIP SOCKET 6POS GOLD

Mill-Max Manufacturing Corp.
3,729 -

RFQ

116-93-306-41-008000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-306-41-008000

116-43-306-41-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,846 -

RFQ

116-43-306-41-008000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-47-306-41-001000

116-47-306-41-001000

STANDRD SOLDRTL DBL SKT

Mill-Max Manufacturing Corp.
2,041 -

RFQ

116-47-306-41-001000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-306-31-012000

614-93-306-31-012000

SOCKET CARRIER LOWPRO .300 6POS

Mill-Max Manufacturing Corp.
3,225 -

RFQ

614-93-306-31-012000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-306-31-012000

614-43-306-31-012000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,114 -

RFQ

614-43-306-31-012000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-93-310-41-007000

116-93-310-41-007000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
2,895 -

RFQ

116-93-310-41-007000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-310-41-007000

116-43-310-41-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,134 -

RFQ

116-43-310-41-007000

Ficha técnica

Tube 116 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-47-320-41-003000

115-47-320-41-003000

CONN IC DIP SOCKET 20POS GOLD

Mill-Max Manufacturing Corp.
3,983 -

RFQ

115-47-320-41-003000

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-99-428-41-001000

110-99-428-41-001000

CONN IC DIP SOCKET 28POS TINLEAD

Mill-Max Manufacturing Corp.
3,515 -

RFQ

110-99-428-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-44-428-41-001000

110-44-428-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,623 -

RFQ

110-44-428-41-001000

Ficha técnica

Tube 110 Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 6162636465666768...608Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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