Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
115-91-316-41-003000

115-91-316-41-003000

SOCKET IC OPEN LOWPRO .300 16POS

Mill-Max Manufacturing Corp.
3,574 -

RFQ

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Thermoplastic
115-41-316-41-003000

115-41-316-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,998 -

RFQ

115-41-316-41-003000

Ficha técnica

Tube 115 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-91-310-41-001000

123-91-310-41-001000

SOCKET IC OPEN 3 LVL .300 10POS

Mill-Max Manufacturing Corp.
2,343 -

RFQ

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
123-41-310-41-001000

123-41-310-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,915 -

RFQ

123-41-310-41-001000

Ficha técnica

Tube 123 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-93-310-41-002000

124-93-310-41-002000

CONN IC DIP SOCKET 10POS GOLD

Mill-Max Manufacturing Corp.
3,545 -

RFQ

124-93-310-41-002000

Ficha técnica

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
124-43-310-41-002000

124-43-310-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,981 -

RFQ

124-43-310-41-002000

Ficha técnica

Tube 124 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-41-310-31-018000

614-41-310-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,269 -

RFQ

614-41-310-31-018000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-91-310-31-018000

614-91-310-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,404 -

RFQ

614-91-310-31-018000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-210-41-001000

614-93-210-41-001000

SOCKET CARRIER LOWPRO .200 10POS

Mill-Max Manufacturing Corp.
3,213 -

RFQ

614-93-210-41-001000

Ficha técnica

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-210-41-001000

614-43-210-41-001000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
2,852 -

RFQ

614-43-210-41-001000

Ficha técnica

Tube 614 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-93-306-11-480000

605-93-306-11-480000

SOCKET CARRIER LOWPRO .300 6POS

Mill-Max Manufacturing Corp.
2,621 -

RFQ

605-93-306-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
605-43-306-11-480000

605-43-306-11-480000

SKT CARRIER LOWPRO

Mill-Max Manufacturing Corp.
2,549 -

RFQ

605-43-306-11-480000

Ficha técnica

Tube 605 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-41-210-41-003000

612-41-210-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,883 -

RFQ

612-41-210-41-003000

Ficha técnica

Tube 612 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-210-41-003000

612-91-210-41-003000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,767 -

RFQ

612-91-210-41-003000

Ficha técnica

Tube 612 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-93-306-31-018000

614-93-306-31-018000

SOCKET CARRIER LOWPRO .300 6POS

Mill-Max Manufacturing Corp.
3,188 -

RFQ

614-93-306-31-018000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
614-43-306-31-018000

614-43-306-31-018000

SKT CARRIER PGA

Mill-Max Manufacturing Corp.
3,636 -

RFQ

614-43-306-31-018000

Ficha técnica

Tube 614 Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
299-43-636-10-002000

299-43-636-10-002000

CONN IC DIP SOCKET 36POS GOLD

Mill-Max Manufacturing Corp.
2,618 -

RFQ

299-43-636-10-002000

Ficha técnica

Tube 299 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-41-314-41-117000

114-41-314-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,054 -

RFQ

114-41-314-41-117000

Ficha técnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
114-91-314-41-117000

114-91-314-41-117000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,726 -

RFQ

114-91-314-41-117000

Ficha técnica

Tube 114 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
210-41-322-41-001000

210-41-322-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,466 -

RFQ

210-41-322-41-001000

Ficha técnica

Tube 210 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 12145 Record«Prev1... 6263646566676869...608Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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