Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
110-44-432-61-001000

110-44-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,097 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-99-432-61-001000

110-99-432-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,326 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-210-61-008000

116-43-210-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,340 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-210-61-008000

116-93-210-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,722 -

RFQ

Tube * Active - - - - - - - - - - - - - -
510-91-022-05-001001

510-91-022-05-001001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,590 -

RFQ

510-91-022-05-001001

Ficha técnica

Bulk 510 Active PGA 22 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-022-05-001002

510-91-022-05-001002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,783 -

RFQ

510-91-022-05-001002

Ficha técnica

Bulk 510 Active PGA 22 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-022-05-001003

510-91-022-05-001003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,145 -

RFQ

510-91-022-05-001003

Ficha técnica

Bulk 510 Active PGA 22 (5 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
311-13-164-41-001000

311-13-164-41-001000

SOCKET LONG SOLDERTAIL SIP 64POS

Mill-Max Manufacturing Corp.
3,379 -

RFQ

Tube 311 Active SIP 64 (1 x 64) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-308-61-008000

116-43-308-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,457 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-308-61-008000

116-93-308-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,148 -

RFQ

Tube * Active - - - - - - - - - - - - - -
127-43-656-41-002000

127-43-656-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,369 -

RFQ

127-43-656-41-002000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
127-93-656-41-002000

127-93-656-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,403 -

RFQ

127-93-656-41-002000

Ficha técnica

Tube 127 Active DIP, 0.6 (15.24mm) Row Spacing 56 (2 x 28) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.070 (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
20-9503-21

20-9503-21

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
3,909 -

RFQ

20-9503-21

Ficha técnica

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
20-9503-31

20-9503-31

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics
2,334 -

RFQ

20-9503-31

Ficha técnica

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6508-20

40-6508-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,943 -

RFQ

40-6508-20

Ficha técnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6508-30

40-6508-30

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,711 -

RFQ

40-6508-30

Ficha técnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
612-41-952-41-004000

612-41-952-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,728 -

RFQ

612-41-952-41-004000

Ficha técnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-91-952-41-004000

612-91-952-41-004000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
2,507 -

RFQ

612-91-952-41-004000

Ficha técnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 52 (2 x 26) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
110-43-314-61-605000

110-43-314-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,353 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-314-61-605000

110-93-314-61-605000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,241 -

RFQ

Tube * Active - - - - - - - - - - - - - -
Total 21991 Record«Prev1... 558559560561562563564565...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário