+86 075582561136
Carregar BOM
Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
510-13-012-05-001002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,147 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 12 (5 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-43-652-41-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,013 | - |
RFQ |
Ficha técnica |
Tube | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
123-47-952-41-001000STANDRD SOLDRTL Mill-Max Manufacturing Corp. |
2,623 | - |
RFQ |
Ficha técnica |
Tube | 123 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-41-656-41-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,075 | - |
RFQ |
Ficha técnica |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 56 (2 x 28) | 0.070 (1.78mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
127-91-656-41-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,505 | - |
RFQ |
Ficha técnica |
Tube | 127 | Active | DIP, 0.6 (15.24mm) Row Spacing | 56 (2 x 28) | 0.070 (1.78mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.070 (1.78mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-93-952-41-001000SOCKET CARRIER SLDRTL .900 52POS Mill-Max Manufacturing Corp. |
2,303 | - |
RFQ |
Ficha técnica |
Tube | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-11-648-41-001000SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp. |
3,997 | - |
RFQ |
Ficha técnica |
Tube | 612 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
612-43-952-41-001000SKT CARRIER SOLDRTL Mill-Max Manufacturing Corp. |
3,076 | - |
RFQ |
Ficha técnica |
Tube | 612 | Active | DIP, 0.9 (22.86mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
25-0503-21CONN SOCKET SIP 25POS GOLD Aries Electronics |
3,391 | - |
RFQ |
Ficha técnica |
Bulk | 0503 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
25-0503-31CONN SOCKET SIP 25POS GOLD Aries Electronics |
3,726 | - |
RFQ |
Ficha técnica |
Bulk | 0503 | Active | SIP | 25 (1 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
18-3508-211CONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,459 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
18-3508-311CONN IC DIP SOCKET 18POS GOLD Aries Electronics |
3,114 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
111-93-314-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,193 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
510-83-441-21-000101CONN SOCKET PGA 441POS GOLD Preci-Dip |
3,622 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 441 (21 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
23-0511-11CONN SOCKET SIP 23POS GOLD Aries Electronics |
3,533 | - |
RFQ |
Ficha técnica |
Bulk | 511 | Active | SIP | 23 (1 x 23) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-6556-3040 POS TEST SOCK RECEPT SOLDER Aries Electronics |
2,800 | - |
RFQ |
- | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
40-6556-20CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
3,400 | - |
RFQ |
Ficha técnica |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
110-43-420-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,600 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-420-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,801 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
517-83-320-19-131111CONN SOCKET PGA 320POS GOLD Preci-Dip |
2,203 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 320 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
- 1500+ Média diária de RFQ
- 20,000.000 Unidade padrão do produto
- 1800+ Fabricantes em todo o mundo
- 15,000+ Armazém em estoque
