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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
28-C182-30CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,085 | - |
RFQ |
Ficha técnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-C212-20CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,552 | - |
RFQ |
Ficha técnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-C212-30CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,506 | - |
RFQ |
Ficha técnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-C300-20CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,874 | - |
RFQ |
Ficha técnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-C300-30CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,851 | - |
RFQ |
Ficha técnica |
Bulk | EJECT-A-DIP™ | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
510-91-032-09-041001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,635 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 32 (9 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-032-09-041002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,622 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 32 (9 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-032-09-041003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,206 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 32 (9 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-43-314-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,163 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-314-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,199 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
50-9513-11HCONN IC DIP SOCKET 50POS GOLD Aries Electronics |
3,504 | - |
RFQ |
Ficha técnica |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
110-43-428-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,922 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-428-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,097 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
123-11-648-41-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,719 | - |
RFQ |
Ficha técnica |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
115-44-636-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,307 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-41-642-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,377 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-91-642-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,964 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
115-44-428-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,687 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-44-652-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,543 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-99-652-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,656 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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