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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
517-87-503-22-131111CONN SOCKET PGA 503POS GOLD Preci-Dip |
2,131 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 503 (22 x 22) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-168-17-101112CONN SOCKET PGA 168POS GOLD Preci-Dip |
3,887 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 168 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
35-0501-21CONN SOCKET SIP 35POS GOLD Aries Electronics |
3,041 | - |
RFQ |
Ficha técnica |
Bulk | 501 | Active | SIP | 35 (1 x 35) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
35-0501-31CONN SOCKET SIP 35POS GOLD Aries Electronics |
3,548 | - |
RFQ |
Ficha técnica |
Bulk | 501 | Active | SIP | 35 (1 x 35) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
APA-648-G-AADAPTER PLUG Samtec Inc. |
2,613 | - |
RFQ |
Bulk | APA | Active | - | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
116-43-322-61-006000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,424 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-43-422-61-006000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,279 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-322-61-006000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,125 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-422-61-006000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,785 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
510-13-022-05-001001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,553 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 22 (5 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-022-05-001002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,409 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 22 (5 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-022-05-001003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,385 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 22 (5 x 5) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
514-83-192M16-001148CONN SOCKET BGA 192POS GOLD Preci-Dip |
2,698 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 192 (16 x 16) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-83-365-17-091111CONN SOCKET PGA 365POS GOLD Preci-Dip |
3,334 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 365 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
517-83-365-14-000111CONN SOCKET PGA 365POS GOLD Preci-Dip |
2,578 | - |
RFQ |
Ficha técnica |
Bulk | 517 | Active | PGA | 365 (14 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
122-13-652-41-001000CONN IC DIP SOCKET 52POS GOLD Mill-Max Manufacturing Corp. |
2,889 | - |
RFQ |
Ficha técnica |
Tube | 122 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-43-318-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,711 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-318-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,886 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-43-636-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,299 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-636-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,838 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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