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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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48-6571-10CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics |
2,140 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-6572-10CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics |
3,297 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-6573-10CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics |
2,065 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-6575-10CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics |
2,436 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
48-6574-10CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics |
3,985 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-3574-10CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics |
2,616 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-6570-10CONN IC DIP SOCKET ZIF 48POS TIN Aries Electronics |
3,124 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
110-43-950-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,774 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
110-93-950-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,497 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
APA-628-G-QADAPTER PLUG Samtec Inc. |
2,162 | - |
RFQ |
Tube | APA | Active | - | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
510-91-073-11-042001SOCKET SOLDERTAIL 73-PGA Mill-Max Manufacturing Corp. |
2,321 | - |
RFQ |
Bulk | 510 | Active | PGA | 73 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-073-11-061001SOCKET SOLDERTAIL 73-PGA Mill-Max Manufacturing Corp. |
3,119 | - |
RFQ |
Bulk | 510 | Active | PGA | 73 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-073-11-042002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,634 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 73 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-073-11-042003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,809 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 73 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-073-11-061002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,145 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 73 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-073-11-061003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,299 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 73 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
116-43-324-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,059 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-43-424-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,400 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-43-624-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,821 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-324-61-001000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,907 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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