Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
111-93-650-61-001000

111-93-650-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,381 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-13-642-61-001000

110-13-642-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,048 -

RFQ

Tube * Active - - - - - - - - - - - - - -
510-91-065-10-051001

510-91-065-10-051001

SOCKET SOLDERTAIL 65-PGA

Mill-Max Manufacturing Corp.
3,096 -

RFQ

Tube 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-065-10-051002

510-91-065-10-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,337 -

RFQ

510-91-065-10-051002

Ficha técnica

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-065-10-051003

510-91-065-10-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,398 -

RFQ

510-91-065-10-051003

Ficha técnica

Bulk 510 Active PGA 65 (10 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
30-3503-21

30-3503-21

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
2,978 -

RFQ

30-3503-21

Ficha técnica

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-3503-31

30-3503-31

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
2,698 -

RFQ

30-3503-31

Ficha técnica

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
546-83-224-18-091136

546-83-224-18-091136

CONN SOCKET PGA 224POS GOLD

Preci-Dip
2,553 -

RFQ

546-83-224-18-091136

Ficha técnica

Bulk 546 Active PGA 224 (18 x 18) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
110-43-952-61-001000

110-43-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,671 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-952-61-001000

110-93-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,696 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-43-624-61-801000

110-43-624-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,467 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-624-61-801000

110-93-624-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,248 -

RFQ

Tube * Active - - - - - - - - - - - - - -
510-91-076-11-041001

510-91-076-11-041001

SOCKET SOLDERTAIL 76-PGA

Mill-Max Manufacturing Corp.
2,840 -

RFQ

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-076-11-041002

510-91-076-11-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,457 -

RFQ

510-91-076-11-041002

Ficha técnica

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-076-11-041003

510-91-076-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,763 -

RFQ

510-91-076-11-041003

Ficha técnica

Bulk 510 Active PGA 76 (11 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
122-13-950-41-001000

122-13-950-41-001000

CONN IC DIP SOCKET 50POS GOLD

Mill-Max Manufacturing Corp.
3,446 -

RFQ

122-13-950-41-001000

Ficha técnica

Tube 122 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
612-11-964-41-001000

612-11-964-41-001000

SKT CARRIER SOLDRTL

Mill-Max Manufacturing Corp.
3,940 -

RFQ

612-11-964-41-001000

Ficha técnica

Tube 612 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) - - Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-052-09-045001

510-93-052-09-045001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,362 -

RFQ

510-93-052-09-045001

Ficha técnica

Bulk 510 Active PGA 52 (9 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-052-09-045002

510-93-052-09-045002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,988 -

RFQ

510-93-052-09-045002

Ficha técnica

Bulk 510 Active PGA 52 (9 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-052-09-045003

510-93-052-09-045003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,857 -

RFQ

510-93-052-09-045003

Ficha técnica

Bulk 510 Active PGA 52 (9 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 612613614615616617618619...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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