Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
22-4508-31

22-4508-31

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics
2,813 -

RFQ

22-4508-31

Ficha técnica

Bulk 508 Active DIP, 0.4 (10.16mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
111-43-950-61-001000

111-43-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,442 -

RFQ

Tube * Active - - - - - - - - - - - - - -
111-93-950-61-001000

111-93-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,771 -

RFQ

Tube * Active - - - - - - - - - - - - - -
517-83-401-19-101111

517-83-401-19-101111

CONN SOCKET PGA 401POS GOLD

Preci-Dip
3,528 -

RFQ

517-83-401-19-101111

Ficha técnica

Bulk 517 Active PGA 401 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-93-064-10-051001

510-93-064-10-051001

SOCKET SOLDERTAIL 64-PGA

Mill-Max Manufacturing Corp.
2,326 -

RFQ

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-064-08-000001

510-93-064-08-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,047 -

RFQ

510-93-064-08-000001

Ficha técnica

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-064-08-000002

510-93-064-08-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,258 -

RFQ

510-93-064-08-000002

Ficha técnica

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-064-08-000003

510-93-064-08-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,149 -

RFQ

510-93-064-08-000003

Ficha técnica

Bulk 510 Active PGA 64 (8 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-064-10-051002

510-93-064-10-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,970 -

RFQ

510-93-064-10-051002

Ficha técnica

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-064-10-051003

510-93-064-10-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,404 -

RFQ

510-93-064-10-051003

Ficha técnica

Bulk 510 Active PGA 64 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
115-43-952-61-001000

115-43-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,112 -

RFQ

Tube * Active - - - - - - - - - - - - - -
115-93-952-61-001000

115-93-952-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,345 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-43-632-61-801000

110-43-632-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,388 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-93-632-61-801000

110-93-632-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,906 -

RFQ

Tube * Active - - - - - - - - - - - - - -
30-9503-21

30-9503-21

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
2,366 -

RFQ

30-9503-21

Ficha técnica

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
30-9503-31

30-9503-31

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics
3,112 -

RFQ

30-9503-31

Ficha técnica

Bulk 503 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
84-PGM11010-40

84-PGM11010-40

CONN SOCKET PGA GOLD

Aries Electronics
2,462 -

RFQ

84-PGM11010-40

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-648-61-006000

116-43-648-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,973 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-648-61-006000

116-93-648-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,480 -

RFQ

Tube * Active - - - - - - - - - - - - - -
32-3503-21

32-3503-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics
2,481 -

RFQ

32-3503-21

Ficha técnica

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Total 21991 Record«Prev1... 625626627628629630631632...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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