Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-6508-311

28-6508-311

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,574 -

RFQ

28-6508-311

Ficha técnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-93-069-11-061001

510-93-069-11-061001

SOCKET SOLDERTAIL 69-PGA

Mill-Max Manufacturing Corp.
3,992 -

RFQ

Tube 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-069-11-061002

510-93-069-11-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,235 -

RFQ

510-93-069-11-061002

Ficha técnica

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-069-11-061003

510-93-069-11-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,202 -

RFQ

510-93-069-11-061003

Ficha técnica

Bulk 510 Active PGA 69 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-642-61-008000

116-43-642-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,305 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-642-61-008000

116-93-642-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,919 -

RFQ

Tube * Active - - - - - - - - - - - - - -
110-13-950-61-001000

110-13-950-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,680 -

RFQ

Tube * Active - - - - - - - - - - - - - -
48-6621-30

48-6621-30

CONN IC DIP SOCKET 48POS TIN

Aries Electronics
2,641 -

RFQ

48-6621-30

Ficha técnica

Bulk 6621 Active DIP, 0.6 (15.24mm) Row Spacing 48 (2 x 24) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
116-43-648-61-003000

116-43-648-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,166 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-648-61-003000

116-93-648-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,907 -

RFQ

Tube * Active - - - - - - - - - - - - - -
517-87-599-54-131111

517-87-599-54-131111

CONN SOCKET PGA 599POS GOLD

Preci-Dip
2,038 -

RFQ

517-87-599-54-131111

Ficha técnica

Bulk 517 Active PGA 599 (54 x 54) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
36-3551-11

36-3551-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics
3,469 -

RFQ

36-3551-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3553-11

36-3553-11

CONN IC DIP SOCKET ZIF 36POS GLD

Aries Electronics
3,231 -

RFQ

36-3553-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
510-91-121-15-061003

510-91-121-15-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,749 -

RFQ

510-91-121-15-061003

Ficha técnica

Bulk 510 Active PGA 121 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-952-61-003000

116-43-952-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,052 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-952-61-003000

116-93-952-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,013 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-43-650-61-008000

116-43-650-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,908 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-650-61-008000

116-93-650-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,502 -

RFQ

Tube * Active - - - - - - - - - - - - - -
510-93-098-13-061003

510-93-098-13-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,787 -

RFQ

510-93-098-13-061003

Ficha técnica

Bulk 510 Active PGA 98 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-652-61-008000

116-43-652-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,428 -

RFQ

Tube * Active - - - - - - - - - - - - - -
Total 21991 Record«Prev1... 630631632633634635636637...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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