Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-3508-211

28-3508-211

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
2,205 -

RFQ

28-3508-211

Ficha técnica

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-3508-311

28-3508-311

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics
3,601 -

RFQ

28-3508-311

Ficha técnica

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-93-176-15-061002

510-93-176-15-061002

CONN PGA SOCKET 176PIN 15X15

Mill-Max Manufacturing Corp.
3,389 -

RFQ

Tube 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-93-964-41-003000

126-93-964-41-003000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.
2,141 -

RFQ

126-93-964-41-003000

Ficha técnica

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
126-43-964-41-003000

126-43-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,542 -

RFQ

126-43-964-41-003000

Ficha técnica

Tube 126 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-950-61-006000

116-43-950-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,283 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-950-61-006000

116-93-950-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,792 -

RFQ

Tube * Active - - - - - - - - - - - - - -
510-93-073-11-042001

510-93-073-11-042001

SOCKET SOLDERTAIL 73-PGA

Mill-Max Manufacturing Corp.
2,109 -

RFQ

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-073-11-061001

510-93-073-11-061001

SOCKET SOLDERTAIL 73-PGA

Mill-Max Manufacturing Corp.
3,168 -

RFQ

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-073-11-042002

510-93-073-11-042002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,513 -

RFQ

510-93-073-11-042002

Ficha técnica

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-073-11-042003

510-93-073-11-042003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,062 -

RFQ

510-93-073-11-042003

Ficha técnica

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-073-11-061002

510-93-073-11-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,772 -

RFQ

510-93-073-11-061002

Ficha técnica

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-073-11-061003

510-93-073-11-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,675 -

RFQ

510-93-073-11-061003

Ficha técnica

Bulk 510 Active PGA 73 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
514-87-292M20-001148

514-87-292M20-001148

CONN SOCKET BGA 292POS GOLD

Preci-Dip
2,059 -

RFQ

514-87-292M20-001148

Ficha técnica

Bulk 514 Active BGA 292 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-43-084-10-031001

510-43-084-10-031001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,268 -

RFQ

510-43-084-10-031001

Ficha técnica

Bulk 510 Active PGA 84 (10 x 10) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-43-084-12-051001

510-43-084-12-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,165 -

RFQ

510-43-084-12-051001

Ficha técnica

Bulk 510 Active PGA 84 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-43-084-11-041001

510-43-084-11-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,018 -

RFQ

510-43-084-11-041001

Ficha técnica

Bulk 510 Active PGA 84 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-43-084-13-081001

510-43-084-13-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,597 -

RFQ

510-43-084-13-081001

Ficha técnica

Bulk 510 Active PGA 84 (13 x 13) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-108-12-051002

510-91-108-12-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,929 -

RFQ

510-91-108-12-051002

Ficha técnica

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-108-12-051003

510-91-108-12-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,856 -

RFQ

510-91-108-12-051003

Ficha técnica

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 633634635636637638639640...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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