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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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510-91-145-13-041001SOCKET SOLDERTAIL 145-PGA Mill-Max Manufacturing Corp. |
2,331 | - |
RFQ |
Bulk | 510 | Active | PGA | 145 (13 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-145-15-002001SOCKET SOLDERTAIL 145-PGA Mill-Max Manufacturing Corp. |
2,674 | - |
RFQ |
Bulk | 510 | Active | PGA | 145 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-91-145-17-001001SOCKET SOLDERTAIL 145-PGA Mill-Max Manufacturing Corp. |
2,376 | - |
RFQ |
Bulk | 510 | Active | PGA | 145 (17 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-41-145-15-002001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,859 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 145 (15 x 15) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-41-145-15-081001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,168 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 145 (15 x 15) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-145-13-041002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,263 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 145 (13 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-145-13-041003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,808 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 145 (13 x 13) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-145-15-002002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,255 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 145 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-145-15-002003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,848 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 145 (15 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-145-17-001002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,476 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 145 (17 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-91-145-17-001003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,835 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 145 (17 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
550-10-356M26-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,749 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 356 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
116-43-964-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
3,239 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
116-93-964-61-003000CONN IC SKT DBL Mill-Max Manufacturing Corp. |
2,946 | - |
RFQ |
Tube | * | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
550-10-255M16-001152BGA SOLDER TAIL Preci-Dip |
3,016 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 255 (16 x 16) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
32-6508-211CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
2,241 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
32-6508-311CONN IC DIP SOCKET 32POS GOLD Aries Electronics |
2,157 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
36-6556-31CONN IC DIP SOCKET 36POS GOLD Aries Electronics |
2,063 | - |
RFQ |
Ficha técnica |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
36-6556-21CONN IC DIP SOCKET 36POS GOLD Aries Electronics |
3,843 | - |
RFQ |
Ficha técnica |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
510-93-049-07-000001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,435 | - |
RFQ |
Ficha técnica |
Tube | 510 | Active | DIP, 0.1 (2.54mm) Row Spacing | 49 (7 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | - | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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