Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
517-87-685-19-000111

517-87-685-19-000111

CONN SOCKET PGA 685POS GOLD

Preci-Dip
2,869 -

RFQ

517-87-685-19-000111

Ficha técnica

Bulk 517 Active PGA 685 (19 x 19) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-91-154-13-021002

510-91-154-13-021002

SOCKET SOLDERTAIL 154-PGA

Mill-Max Manufacturing Corp.
3,036 -

RFQ

Bulk 510 Active PGA 154 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-154-13-021001

510-91-154-13-021001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,573 -

RFQ

510-91-154-13-021001

Ficha técnica

Bulk 510 Active PGA 154 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-154-13-021003

510-91-154-13-021003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,755 -

RFQ

510-91-154-13-021003

Ficha técnica

Bulk 510 Active PGA 154 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
232-1291-00-0602J

232-1291-00-0602J

CONN IC DIP SOCKET ZIF 32POS GLD

3M
3,057 -

RFQ

232-1291-00-0602J

Ficha técnica

Bulk Textool™ Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.070 (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Connector Closed Frame Press-Fit 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Polysulfone (PSU), Glass Filled
510-91-155-16-003002

510-91-155-16-003002

SOCKET SOLDERTAIL 155-PGA

Mill-Max Manufacturing Corp.
2,018 -

RFQ

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-155-18-121002

510-91-155-18-121002

SOCKET SOLDERTAIL 155-PGA

Mill-Max Manufacturing Corp.
2,922 -

RFQ

Bulk 510 Active PGA 155 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-155-16-003002

510-41-155-16-003002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,553 -

RFQ

510-41-155-16-003002

Ficha técnica

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-169-13-000001

510-91-169-13-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,000 -

RFQ

510-91-169-13-000001

Ficha técnica

Bulk 510 Active PGA 169 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-169-13-000003

510-91-169-13-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,342 -

RFQ

510-91-169-13-000003

Ficha técnica

Bulk 510 Active PGA 169 (13 x 13) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-169-17-101001

510-91-169-17-101001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,709 -

RFQ

510-91-169-17-101001

Ficha técnica

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-169-17-101003

510-91-169-17-101003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,521 -

RFQ

510-91-169-17-101003

Ficha técnica

Bulk 510 Active PGA 169 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-155-16-003001

510-91-155-16-003001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,476 -

RFQ

510-91-155-16-003001

Ficha técnica

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-155-16-003003

510-91-155-16-003003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,818 -

RFQ

510-91-155-16-003003

Ficha técnica

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-155-18-121001

510-91-155-18-121001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,660 -

RFQ

510-91-155-18-121001

Ficha técnica

Bulk 510 Active PGA 155 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-155-18-121003

510-91-155-18-121003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,849 -

RFQ

510-91-155-18-121003

Ficha técnica

Bulk 510 Active PGA 155 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
42-3551-11

42-3551-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics
3,265 -

RFQ

42-3551-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3552-11

42-3552-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics
3,776 -

RFQ

42-3552-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3553-11

42-3553-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics
3,087 -

RFQ

42-3553-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6551-11

42-6551-11

CONN IC DIP SOCKET ZIF 42POS GLD

Aries Electronics
2,104 -

RFQ

42-6551-11

Ficha técnica

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
Total 21991 Record«Prev1... 653654655656657658659660...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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