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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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510-93-149-15-063002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,464 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 149 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-149-15-063003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,807 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 149 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
558-10-255M16-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,642 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 255 (16 x 16) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-87-352M26-001148CONN SOCKET BGA 352POS GOLD Preci-Dip |
3,789 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 352 (26 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-238-19-101112CONN SOCKET PGA 238POS GOLD Preci-Dip |
3,018 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-391-18-101147CONN SOCKET PGA 391POS GOLD Preci-Dip |
3,724 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 391 (18 x 18) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-299-20-001117CONN SOCKET PGA 299POS GOLD Preci-Dip |
3,566 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | PGA | 299 (20 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-256M16-000104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,658 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 256 (16 x 16) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-256M20-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,594 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 256 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-255M16-001105CONN SOCKET PGA 255POS GOLD Preci-Dip |
2,993 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 255 (16 x 16) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-272M20-001101PGA SOLDER TAIL 1.27MM Preci-Dip |
3,183 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | PGA | 272 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
28-3508-21CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,936 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-3508-31CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
3,131 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
42-6556-31CONN IC DIP SOCKET 42POS GOLD Aries Electronics |
2,849 | - |
RFQ |
Ficha técnica |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
42-6556-21CONN IC DIP SOCKET 42POS GOLD Aries Electronics |
2,852 | - |
RFQ |
Ficha técnica |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
510-13-088-12-052001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,713 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 88 (12 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-088-12-052002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,010 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 88 (12 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-088-12-052003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,910 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 88 (12 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-088-13-062002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,518 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 88 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-088-13-062003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,863 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 88 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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