Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-155-16-003001

510-93-155-16-003001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,510 -

RFQ

510-93-155-16-003001

Ficha técnica

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-155-16-003003

510-93-155-16-003003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,426 -

RFQ

510-93-155-16-003003

Ficha técnica

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-155-18-121001

510-93-155-18-121001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,598 -

RFQ

510-93-155-18-121001

Ficha técnica

Bulk 510 Active PGA 155 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-155-18-121003

510-93-155-18-121003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,712 -

RFQ

510-93-155-18-121003

Ficha técnica

Bulk 510 Active PGA 155 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-43-155-16-003002

510-43-155-16-003002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,765 -

RFQ

510-43-155-16-003002

Ficha técnica

Bulk 510 Active PGA 155 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-292M20-001152

550-10-292M20-001152

BGA SOLDER TAIL

Preci-Dip
3,688 -

RFQ

550-10-292M20-001152

Ficha técnica

Bulk 550 Active BGA 292 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-93-156-15-061002

510-93-156-15-061002

SOCKET SOLDERTAIL 156-PGA

Mill-Max Manufacturing Corp.
3,147 -

RFQ

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-156-15-061001

510-93-156-15-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,672 -

RFQ

510-93-156-15-061001

Ficha técnica

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-156-15-061003

510-93-156-15-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,919 -

RFQ

510-93-156-15-061003

Ficha técnica

Bulk 510 Active PGA 156 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
518-77-255M16-001106

518-77-255M16-001106

CONN SOCKET PGA 255POS GOLD

Preci-Dip
3,579 -

RFQ

518-77-255M16-001106

Ficha técnica

Bulk 518 Active PGA 255 (16 x 16) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
518-77-256M16-000106

518-77-256M16-000106

CONN SOCKET PGA 256POS GOLD

Preci-Dip
2,136 -

RFQ

518-77-256M16-000106

Ficha técnica

Bulk 518 Active PGA 256 (16 x 16) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
518-77-256M20-001106

518-77-256M20-001106

CONN SOCKET PGA 256POS GOLD

Preci-Dip
3,942 -

RFQ

518-77-256M20-001106

Ficha técnica

Bulk 518 Active PGA 256 (20 x 20) 0.050 (1.27mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.050 (1.27mm) Gold Flash Brass FR4 Epoxy Glass
510-13-092-11-041001

510-13-092-11-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,303 -

RFQ

510-13-092-11-041001

Ficha técnica

Bulk 510 Active PGA 92 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-092-11-041002

510-13-092-11-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,691 -

RFQ

510-13-092-11-041002

Ficha técnica

Bulk 510 Active PGA 92 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-092-11-041003

510-13-092-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,544 -

RFQ

510-13-092-11-041003

Ficha técnica

Bulk 510 Active PGA 92 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-83-528-21-121111

517-83-528-21-121111

CONN SOCKET PGA 528POS GOLD

Preci-Dip
3,650 -

RFQ

517-83-528-21-121111

Ficha técnica

Bulk 517 Active PGA 528 (21 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
441-PPG21001-10

441-PPG21001-10

CONN SOCKET PGA ZIF GOLD

Aries Electronics
3,614 -

RFQ

441-PPG21001-10

Ficha técnica

Bulk - Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
614-87-299-20-001112

614-87-299-20-001112

CONN SOCKET PGA 299POS GOLD

Preci-Dip
3,123 -

RFQ

614-87-299-20-001112

Ficha técnica

Bulk 614 Active PGA 299 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-93-159-16-105001

510-93-159-16-105001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,770 -

RFQ

510-93-159-16-105001

Ficha técnica

Bulk 510 Active PGA 159 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-159-16-105002

510-93-159-16-105002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,482 -

RFQ

510-93-159-16-105002

Ficha técnica

Bulk 510 Active PGA 159 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 671672673674675676677678...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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