Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-159-16-105003

510-93-159-16-105003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,100 -

RFQ

510-93-159-16-105003

Ficha técnica

Bulk 510 Active PGA 159 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
116-43-964-61-001000

116-43-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
3,055 -

RFQ

Tube * Active - - - - - - - - - - - - - -
116-93-964-61-001000

116-93-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.
2,975 -

RFQ

Tube * Active - - - - - - - - - - - - - -
APA-640-G-Q

APA-640-G-Q

ADAPTER PLUG

Samtec Inc.
3,709 -

RFQ

Tube APA Active - 40 (2 x 20) 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame Solder 0.100 (2.54mm) Gold 20.0µin (0.51µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled
510-93-161-15-005001

510-93-161-15-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,621 -

RFQ

510-93-161-15-005001

Ficha técnica

Bulk 510 Active PGA 161 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-161-15-005002

510-93-161-15-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,976 -

RFQ

510-93-161-15-005002

Ficha técnica

Bulk 510 Active PGA 161 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-161-15-005003

510-93-161-15-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,018 -

RFQ

510-93-161-15-005003

Ficha técnica

Bulk 510 Active PGA 161 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-93-223-18-098006

517-93-223-18-098006

PGA SOCK 223 PIN 18X18 SOLDER TL

Mill-Max Manufacturing Corp.
3,162 -

RFQ

517-93-223-18-098006

Ficha técnica

Tube 517 Active PGA 223 (18 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
517-83-529-21-121111

517-83-529-21-121111

CONN SOCKET PGA 529POS GOLD

Preci-Dip
3,755 -

RFQ

517-83-529-21-121111

Ficha técnica

Bulk 517 Active PGA 529 (21 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-91-209-17-081001

510-91-209-17-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,289 -

RFQ

510-91-209-17-081001

Ficha técnica

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-209-17-081002

510-91-209-17-081002

SOCKET SOLDERTAIL 209-PGA

Mill-Max Manufacturing Corp.
3,181 -

RFQ

Bulk 510 Active PGA 209 (17 x 17) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
64-9508-30

64-9508-30

CONN IC DIP SOCKET 64POS GOLD

Aries Electronics
2,039 -

RFQ

64-9508-30

Ficha técnica

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 64 (2 x 32) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
510-93-177-15-061001

510-93-177-15-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,653 -

RFQ

510-93-177-15-061001

Ficha técnica

Bulk 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-177-15-061002

510-93-177-15-061002

SOCKET SOLDERTAIL 177-PGA

Mill-Max Manufacturing Corp.
3,146 -

RFQ

Tube 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-177-15-061003

510-93-177-15-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,771 -

RFQ

510-93-177-15-061003

Ficha técnica

Tube 510 Active PGA 177 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-096-11-041001

510-13-096-11-041001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,416 -

RFQ

510-13-096-11-041001

Ficha técnica

Tube 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-096-11-041002

510-13-096-11-041002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,769 -

RFQ

510-13-096-11-041002

Ficha técnica

Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-096-11-041003

510-13-096-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,594 -

RFQ

510-13-096-11-041003

Ficha técnica

Bulk 510 Active PGA 96 (11 x 11) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-420M26-001166

550-10-420M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,666 -

RFQ

550-10-420M26-001166

Ficha técnica

Bulk 550 Active BGA 420 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-325-18-111147

546-83-325-18-111147

CONN SOCKET PGA 325POS GOLD

Preci-Dip
2,546 -

RFQ

546-83-325-18-111147

Ficha técnica

Bulk 546 Active PGA 325 (18 x 18) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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