Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-91-225-15-000003

510-91-225-15-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,268 -

RFQ

510-91-225-15-000003

Ficha técnica

Bulk 510 Active PGA 225 (15 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-225-18-091001

510-91-225-18-091001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,687 -

RFQ

510-91-225-18-091001

Ficha técnica

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-225-18-091003

510-91-225-18-091003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,634 -

RFQ

510-91-225-18-091003

Ficha técnica

Bulk 510 Active PGA 225 (18 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
558-10-292M20-001101

558-10-292M20-001101

PGA SOLDER TAIL 1.27MM

Preci-Dip
3,109 -

RFQ

558-10-292M20-001101

Ficha técnica

Bulk 558 Active PGA 292 (20 x 20) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-93-175-16-006002

510-93-175-16-006002

CONN SOCKET PGA 175POS GOLD

Mill-Max Manufacturing Corp.
3,643 -

RFQ

510-93-175-16-006002

Ficha técnica

Tube 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-175-16-005001

510-93-175-16-005001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,887 -

RFQ

510-93-175-16-005001

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-175-16-005002

510-93-175-16-005002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,507 -

RFQ

510-93-175-16-005002

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-175-16-005003

510-93-175-16-005003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,875 -

RFQ

510-93-175-16-005003

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-175-16-006001

510-93-175-16-006001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,853 -

RFQ

510-93-175-16-006001

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-175-16-006003

510-93-175-16-006003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,638 -

RFQ

510-93-175-16-006003

Ficha técnica

Bulk 510 Active PGA 175 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-432M31-001166

550-10-432M31-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
3,634 -

RFQ

550-10-432M31-001166

Ficha técnica

Bulk 550 Active BGA 432 (31 x 31) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-43-176-15-061002

510-43-176-15-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,253 -

RFQ

510-43-176-15-061002

Ficha técnica

Bulk 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-176-15-061001

510-93-176-15-061001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,363 -

RFQ

510-93-176-15-061001

Ficha técnica

Bulk 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-176-15-061003

510-93-176-15-061003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,058 -

RFQ

510-93-176-15-061003

Ficha técnica

Bulk 510 Active PGA 176 (15 x 15) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
1437522-4

1437522-4

CONN SOCKET PGA 321POS GOLD

TE Connectivity AMP Connectors
2,200 -

RFQ

1437522-4

Ficha técnica

Bulk - Active PGA 321 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Copper Alloy Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead - Copper Alloy Thermoplastic, Polyester
40-6508-211

40-6508-211

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
3,826 -

RFQ

40-6508-211

Ficha técnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6508-311

40-6508-311

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,529 -

RFQ

40-6508-311

Ficha técnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
517-83-559-22-131111

517-83-559-22-131111

CONN SOCKET PGA 559POS GOLD

Preci-Dip
3,167 -

RFQ

517-83-559-22-131111

Ficha técnica

Bulk 517 Active PGA 559 (22 x 22) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
133-PGM14014-40

133-PGM14014-40

CONN SOCKET PGA GOLD

Aries Electronics
2,250 -

RFQ

133-PGM14014-40

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
133-PGM14014-50

133-PGM14014-50

CONN SOCKET PGA GOLD

Aries Electronics
3,749 -

RFQ

133-PGM14014-50

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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