Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-93-196-14-000003

510-93-196-14-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,696 -

RFQ

510-93-196-14-000003

Ficha técnica

Bulk 510 Active PGA 196 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
546-83-321-19-121147

546-83-321-19-121147

CONN SOCKET PGA 321POS GOLD

Preci-Dip
2,613 -

RFQ

546-83-321-19-121147

Ficha técnica

Bulk 546 Active PGA 321 (19 x 19) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
88-PGM13028-10H

88-PGM13028-10H

CONN SOCKET PGA GOLD

Aries Electronics
3,977 -

RFQ

88-PGM13028-10H

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
517-83-565-21-111111

517-83-565-21-111111

CONN SOCKET PGA 565POS GOLD

Preci-Dip
2,048 -

RFQ

517-83-565-21-111111

Ficha técnica

Bulk 517 Active PGA 565 (21 x 21) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
514-87-400M20-000148

514-87-400M20-000148

CONN SOCKET BGA 400POS GOLD

Preci-Dip
2,310 -

RFQ

514-87-400M20-000148

Ficha técnica

Bulk 514 Active BGA 400 (20 x 20) 0.100 (2.54mm) Gold Flash Beryllium Copper Surface Mount Closed Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-91-238-19-086002

510-91-238-19-086002

SOCKET SOLDERTAIL 238-PGA

Mill-Max Manufacturing Corp.
3,403 -

RFQ

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-238-19-086001

510-91-238-19-086001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,088 -

RFQ

510-91-238-19-086001

Ficha técnica

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-238-19-086003

510-91-238-19-086003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,228 -

RFQ

510-91-238-19-086003

Ficha técnica

Bulk 510 Active PGA 238 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-456M26-001166

550-10-456M26-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,878 -

RFQ

550-10-456M26-001166

Ficha técnica

Bulk 550 Active BGA 456 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-13-108-12-051002

510-13-108-12-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,704 -

RFQ

510-13-108-12-051002

Ficha técnica

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-108-12-051003

510-13-108-12-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,885 -

RFQ

510-13-108-12-051003

Ficha técnica

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-108-12-051001

510-13-108-12-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,316 -

RFQ

510-13-108-12-051001

Ficha técnica

Bulk 510 Active PGA 108 (12 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-41-256-16-000002

510-41-256-16-000002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,924 -

RFQ

510-41-256-16-000002

Ficha técnica

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) - - Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-256-16-000002

510-91-256-16-000002

SOCKET SOLDERTAIL 256-PGA

Mill-Max Manufacturing Corp.
2,671 -

RFQ

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-256-19-081002

510-91-256-19-081002

SOCKET SOLDERTAIL 256-PGA

Mill-Max Manufacturing Corp.
3,583 -

RFQ

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-256-16-000001

510-91-256-16-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,902 -

RFQ

510-91-256-16-000001

Ficha técnica

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-256-16-000003

510-91-256-16-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,761 -

RFQ

510-91-256-16-000003

Ficha técnica

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-256-19-081001

510-91-256-19-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,100 -

RFQ

510-91-256-19-081001

Ficha técnica

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-91-256-19-081003

510-91-256-19-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,216 -

RFQ

510-91-256-19-081003

Ficha técnica

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
40-6508-212

40-6508-212

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics
2,782 -

RFQ

40-6508-212

Ficha técnica

Bulk 508 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

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