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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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510-13-128-13-041002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,155 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 128 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-128-13-041001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,301 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 128 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-128-13-041003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,040 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 128 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
APA-648-G-BADAPTER PLUG Samtec Inc. |
2,300 | - |
RFQ |
Bulk | APA | Active | - | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
|
614-83-279-19-081112CONN SOCKET PGA 279POS GOLD Preci-Dip |
3,377 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 279 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-93-238-19-086002PGS SOCK 238 PIN 19X19 SOLDER TL Mill-Max Manufacturing Corp. |
3,987 | - |
RFQ |
Bulk | 510 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | |
|
|
510-93-238-19-086001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,802 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-238-19-086003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,051 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 238 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
48-3570-11CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics |
3,848 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
24-6556-41CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
2,085 | - |
RFQ |
Ficha técnica |
Bulk | 6556 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder Cup | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
514-83-357M19-001148CONN SOCKET BGA 357POS GOLD Preci-Dip |
2,883 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 357 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
100-PGM10001-51CONN SOCKET PGA GOLD Aries Electronics |
2,159 | - |
RFQ |
Ficha técnica |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
32-3574-16CONN IC DIP SOCKET ZIF 32POS Aries Electronics |
2,146 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
614-87-320-19-131144CONN SOCKET PGA 320POS GOLD Preci-Dip |
2,252 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 320 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-321-19-121144CONN SOCKET PGA 321POS GOLD Preci-Dip |
2,824 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 321 (19 x 19) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-356M26-001152BGA SOLDER TAIL Preci-Dip |
3,362 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 356 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
510-13-142-15-085001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,337 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 142 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-142-15-085002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,600 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 142 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
48-3572-11CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics |
2,991 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
48-3573-11CONN IC DIP SOCKET ZIF 48POS GLD Aries Electronics |
2,152 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
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