Soquetes para CIs, Transistores

Foto: Número da peça do fabricante Disponibilidade Preço Quantidade Ficha técnica Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
510-13-135-14-051003

510-13-135-14-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,040 -

RFQ

510-13-135-14-051003

Ficha técnica

Bulk 510 Active PGA 135 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-136-14-051001

510-13-136-14-051001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,680 -

RFQ

510-13-136-14-051001

Ficha técnica

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-136-14-051002

510-13-136-14-051002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,279 -

RFQ

510-13-136-14-051002

Ficha técnica

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-13-136-14-051003

510-13-136-14-051003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,357 -

RFQ

510-13-136-14-051003

Ficha técnica

Bulk 510 Active PGA 136 (14 x 14) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
550-10-500M30-001166

550-10-500M30-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,945 -

RFQ

550-10-500M30-001166

Ficha técnica

Bulk 550 Active BGA 500 (30 x 30) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
514-83-352M26-001148

514-83-352M26-001148

CONN SOCKET BGA 352POS GOLD

Preci-Dip
2,656 -

RFQ

514-83-352M26-001148

Ficha técnica

Bulk 514 Active BGA 352 (26 x 26) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
517-83-685-19-000111

517-83-685-19-000111

CONN SOCKET PGA 685POS GOLD

Preci-Dip
2,445 -

RFQ

517-83-685-19-000111

Ficha técnica

Bulk 517 Active PGA 685 (19 x 19) 0.100 (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
614-87-325-18-111144

614-87-325-18-111144

CONN SOCKET PGA 325POS GOLD

Preci-Dip
2,257 -

RFQ

614-87-325-18-111144

Ficha técnica

Bulk 614 Active PGA 325 (18 x 18) 0.100 (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100 (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
101-PGM13022-10H

101-PGM13022-10H

CONN SOCKET PGA GOLD

Aries Electronics
3,951 -

RFQ

101-PGM13022-10H

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-504M29-001166

550-10-504M29-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip
2,983 -

RFQ

550-10-504M29-001166

Ficha técnica

Bulk 550 Active BGA 504 (29 x 29) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
510-93-256-16-000002

510-93-256-16-000002

SOCKET SOLDERTAIL 256-PGA

Mill-Max Manufacturing Corp.
3,063 -

RFQ

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-256-19-081002

510-93-256-19-081002

SOCKET SOLDERTAIL 256-PGA

Mill-Max Manufacturing Corp.
2,363 -

RFQ

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-256-16-000001

510-93-256-16-000001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,629 -

RFQ

510-93-256-16-000001

Ficha técnica

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-256-16-000003

510-93-256-16-000003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,056 -

RFQ

510-93-256-16-000003

Ficha técnica

Bulk 510 Active PGA 256 (16 x 16) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-256-19-081001

510-93-256-19-081001

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,394 -

RFQ

510-93-256-19-081001

Ficha técnica

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
510-93-256-19-081003

510-93-256-19-081003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
3,801 -

RFQ

510-93-256-19-081003

Ficha técnica

Bulk 510 Active PGA 256 (19 x 19) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
160-PGM14029-40

160-PGM14029-40

CONN SOCKET PGA GOLD

Aries Electronics
3,823 -

RFQ

160-PGM14029-40

Ficha técnica

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
550-10-352M26-001152

550-10-352M26-001152

BGA SOLDER TAIL

Preci-Dip
3,710 -

RFQ

550-10-352M26-001152

Ficha técnica

Bulk 550 Active BGA 352 (26 x 26) 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050 (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass
546-83-391-18-101147

546-83-391-18-101147

CONN SOCKET PGA 391POS GOLD

Preci-Dip
3,084 -

RFQ

546-83-391-18-101147

Ficha técnica

Bulk 546 Active PGA 391 (18 x 18) 0.050 (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100 (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
510-43-240-17-061002

510-43-240-17-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.
2,291 -

RFQ

510-43-240-17-061002

Ficha técnica

Bulk 510 Active PGA 240 (17 x 17) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Total 21991 Record«Prev1... 689690691692693694695696...1100Next»
1500+
1500+ Média diária de RFQ
20,000.000
20,000.000 Unidade padrão do produto
1800+
1800+ Fabricantes em todo o mundo
15,000+
15,000+ Armazém em estoque
Fudong Communication (Shenzhen) Grupo Co., Ltd.

Início

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Produto

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Telefone

Fudong Communication (Shenzhen) Grupo Co., Ltd.

Usuário