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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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36-6572-16CONN IC DIP SOCKET ZIF 36POS TIN Aries Electronics |
2,691 | - |
RFQ |
Ficha técnica |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
224-5809-50-06023M TEXTOOL ZIP STRIP SOCKETS 224 3M |
2,582 | - |
RFQ |
Box | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
232-2601-50-0602IN-LINE ZIP STRIP POCKETS 32 CON 3M |
2,839 | - |
RFQ |
- | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
|
|
514-83-432M31-001148CONN SOCKET BGA 432POS GOLD Preci-Dip |
2,449 | - |
RFQ |
Ficha técnica |
Bulk | 514 | Active | BGA | 432 (31 x 31) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-320-19-131144CONN SOCKET PGA 320POS GOLD Preci-Dip |
3,729 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 320 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-600M35-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
3,299 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 600 (35 x 35) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
614-83-321-19-121144CONN SOCKET PGA 321POS GOLD Preci-Dip |
3,306 | - |
RFQ |
Ficha técnica |
Bulk | 614 | Active | PGA | 321 (21 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-381-18-101135PGA SOLDER TAIL Preci-Dip |
2,631 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | PGA | 381 (18 x 18) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-463-19-101147CONN SOCKET PGA 463POS GOLD Preci-Dip |
3,240 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 463 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-432M31-001152BGA SOLDER TAIL Preci-Dip |
2,306 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
510-93-361-19-000002SOCKET SOLDERTAIL 361-PGA Mill-Max Manufacturing Corp. |
3,809 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 361 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-361-19-000001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,128 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 361 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-93-361-19-000003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,214 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 361 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-196-14-000001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,686 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 196 (14 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-196-14-000002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,786 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 196 (14 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-196-14-000003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,873 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 196 (14 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
558-10-388M26-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
2,007 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 388 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
144-PGM12001-51CONN SOCKET PGA GOLD Aries Electronics |
3,416 | - |
RFQ |
Ficha técnica |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
518-77-388M26-001105CONN SOCKET PGA 388POS GOLD Preci-Dip |
3,061 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 388 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
510-91-441-21-000001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,055 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 441 (21 x 21) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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