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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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510-93-400-20-000003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,017 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 400 (20 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
132-PGM13038-50CONN SOCKET PGA GOLD Aries Electronics |
2,392 | - |
RFQ |
- | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | |
|
|
510-11-256-16-000001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,912 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 256 (16 x 16) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-11-256-16-000002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,381 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 256 (16 x 16) | 0.100 (2.54mm) | - | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | - | - | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
550-10-652M35-001166BGA PIN ADAPTER 1.27MM SMD Preci-Dip |
2,170 | - |
RFQ |
Ficha técnica |
Bulk | 550 | Active | BGA | 652 (35 x 35) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-83-503-22-131147CONN SOCKET PGA 503POS GOLD Preci-Dip |
3,708 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 503 (22 x 22) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-296-19-131147CONN SOCKET PGA 296POS GOLD Preci-Dip |
2,029 | - |
RFQ |
Ficha técnica |
Bulk | 546 | Active | PGA | 296 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-420M26-001104BGA SURFACE MOUNT 1.27MM Preci-Dip |
3,020 | - |
RFQ |
Ficha técnica |
Bulk | 558 | Active | BGA | 420 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
510-13-223-18-095001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,012 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-223-18-095003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,003 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-223-18-098001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,978 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-223-18-098002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,881 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-223-18-098003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,470 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-223-18-095002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,707 | - |
RFQ |
Ficha técnica |
Tube | 510 | Active | PGA | 223 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
518-77-420M26-001105CONN SOCKET PGA 420POS GOLD Preci-Dip |
3,126 | - |
RFQ |
Ficha técnica |
Bulk | 518 | Active | PGA | 420 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
510-13-224-18-095001SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
3,507 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 224 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-224-18-095003SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,158 | - |
RFQ |
Ficha técnica |
Bulk | 510 | Active | PGA | 224 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
510-13-224-18-095002SKT PGA SOLDRTL Mill-Max Manufacturing Corp. |
2,268 | - |
RFQ |
Ficha técnica |
Tube | 510 | Active | PGA | 224 (18 x 18) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
50-9508-21CONN IC DIP SOCKET 50POS GOLD Aries Electronics |
2,866 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
50-9508-31CONN IC DIP SOCKET 50POS GOLD Aries Electronics |
3,527 | - |
RFQ |
Ficha técnica |
Bulk | 508 | Active | DIP, 0.9 (22.86mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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