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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
212-1-08-003CONN IC DIP SOCKET 8POS GOLD CNC Tech |
3,394 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-14-003CONN IC DIP SOCKET 14POS GOLD CNC Tech |
2,011 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-16-003CONN IC DIP SOCKET 16POS GOLD CNC Tech |
3,873 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-18-003CONN IC DIP SOCKET 18POS GOLD CNC Tech |
3,332 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-20-003CONN IC DIP SOCKET 20POS GOLD CNC Tech |
3,041 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-24-006CONN IC DIP SOCKET 24POS GOLD CNC Tech |
3,208 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-28-006CONN IC DIP SOCKET 28POS GOLD CNC Tech |
2,919 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-32-006CONN IC DIP SOCKET 32POS GOLD CNC Tech |
2,972 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-40-006CONN IC DIP SOCKET 40POS GOLD CNC Tech |
2,100 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
212-1-48-006CONN IC DIP SOCKET 48POS GOLD CNC Tech |
3,586 | - |
RFQ |
Ficha técnica |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
|
241-48-1-06CONN IC DIP SOCKET 48POS TIN CNC Tech |
3,631 | - |
RFQ |
Ficha técnica |
Tube | - | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled |
|
|
523-93-121-13-061001PGA SOCK 121PIN 13X13 WIRE WRAP Mill-Max Manufacturing Corp. |
3,398 | - |
RFQ |
Ficha técnica |
Bulk | 523 | Active | PGA | 121 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
C8108-04CONN IC DIP SOCKET 8POS TIN Aries Electronics |
2,095 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C81 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C8114-04CONN IC DIP SOCKET 14POS TIN Aries Electronics |
2,282 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C81 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C8116-04CONN IC DIP SOCKET 16POS TIN Aries Electronics |
3,127 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C81 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C8118-04CONN IC DIP SOCKET 18POS TIN Aries Electronics |
2,786 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C81 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C8120-04CONN IC DIP SOCKET 20POS TIN Aries Electronics |
2,549 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C81 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
C8122-04CONN IC DIP SOCKET 22POS TIN Aries Electronics |
2,386 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C81 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C8124-04CONN IC DIP SOCKET 24POS TIN Aries Electronics |
2,285 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C81 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C8128-04CONN IC DIP SOCKET 28POS TIN Aries Electronics |
2,267 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C81 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
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