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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
C8140-04CONN IC DIP SOCKET 40POS TIN Aries Electronics |
2,480 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C81 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C9108-00CONN IC DIP SOCKET 8POS GOLD Aries Electronics |
3,597 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C91 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C9114-00CONN IC DIP SOCKET 14POS GOLD Aries Electronics |
2,546 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C91 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C9116-00CONN IC DIP SOCKET 16POS GOLD Aries Electronics |
3,939 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C91 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C9118-00CONN IC DIP SOCKET 18POS GOLD Aries Electronics |
2,056 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C91 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C9120-00CONN IC DIP SOCKET 20POS GOLD Aries Electronics |
2,464 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C91 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C9122-00CONN IC DIP SOCKET 22POS GOLD Aries Electronics |
2,150 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C91 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C9124-00CONN IC DIP SOCKET 24POS GOLD Aries Electronics |
3,361 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C91 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C9128-00CONN IC DIP SOCKET 28POS GOLD Aries Electronics |
2,352 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C91 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
C9140-00CONN IC DIP SOCKET 40POS GOLD Aries Electronics |
3,678 | - |
RFQ |
Ficha técnica |
Bulk | Edge-Grip™, C91 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
40-516-10CONN IC DIP SOCKET ZIF 40POS TIN Aries Electronics |
3,332 | - |
RFQ |
Ficha técnica |
Bulk | 516 | Obsolete | DIP, ZIF (ZIP) | 40 (2 x 20) | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
24-516-10CONN IC DIP SOCKET ZIF 24POS TIN Aries Electronics |
3,629 | - |
RFQ |
Ficha técnica |
Bulk | 516 | Obsolete | DIP, ZIF (ZIP) | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 10.0µin (0.25µm) | Beryllium Copper | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
523-93-144-15-082001PGA SOCK 144PIN 15X15 WIRE WRAP Mill-Max Manufacturing Corp. |
2,149 | - |
RFQ |
Ficha técnica |
Bulk | 523 | Active | PGA | 144 (15 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
523-93-114-13-062001PGA SOCK 114PIN 13X13 WIRE WRAP Mill-Max Manufacturing Corp. |
3,858 | - |
RFQ |
Ficha técnica |
Bulk | 523 | Active | PGA | 114 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | - | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | - | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
2-641296-4CONN IC DIP SOCKET 6POS GOLD TE Connectivity AMP Connectors |
2,843 | - |
RFQ |
Tube,Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled | |
|
2-640463-4CONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
2,639 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-640357-4CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
2,667 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-640358-4CONN IC DIP SOCKET 16POS GOLD TE Connectivity AMP Connectors |
3,417 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
|
2-640359-4CONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
3,085 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic |
|
2-640464-4CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
3,174 | - |
RFQ |
Ficha técnica |
Tube | Diplomate DL | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Thermoplastic, Glass Filled |
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