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Soquetes para CIs, Transistores
| Foto: | Número da peça do fabricante | Disponibilidade | Preço | Quantidade | Ficha técnica | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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100-016-001CONN IC DIP SOCKET 16POS GOLD 3M |
2,765 | - |
RFQ |
Ficha técnica |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
100-018-000CONN IC DIP SOCKET 18POS GOLD 3M |
2,897 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-018-001CONN IC DIP SOCKET 18POS GOLD 3M |
2,191 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-020-000CONN IC DIP SOCKET 20POS GOLD 3M |
2,265 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-020-001CONN IC DIP SOCKET 20POS GOLD 3M |
2,751 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-022-000CONN IC DIP SOCKET 22POS GOLD 3M |
2,959 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-024-000CONN IC DIP SOCKET 24POS GOLD 3M |
2,541 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-024-001CONN IC DIP SOCKET 24POS GOLD 3M |
3,830 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-028-000CONN IC DIP SOCKET 28POS GOLD 3M |
3,528 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-028-001CONN IC DIP SOCKET 28POS GOLD 3M |
2,149 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-032-000CONN IC DIP SOCKET 32POS GOLD 3M |
2,162 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-032-001CONN IC DIP SOCKET 32POS GOLD 3M |
2,363 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-040-000CONN IC DIP SOCKET 40POS GOLD 3M |
3,329 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-040-001CONN IC DIP SOCKET 40POS GOLD 3M |
3,558 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-042-000CONN IC DIP SOCKET 42POS GOLD 3M |
3,799 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
100-048-000CONN IC DIP SOCKET 48POS GOLD 3M |
2,324 | - |
RFQ |
Bulk | 100 | Obsolete | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | Flash | Brass | Polyphenylene Sulfide (PPS), Glass Filled | |
|
|
4828-3000-CPCONN IC DIP SOCKET 28POS TIN 3M |
2,224 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
4824-3004-CPCONN IC DIP SOCKET 24POS TIN 3M |
2,147 | - |
RFQ |
Ficha técnica |
Tube | 4800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
|
1-390261-0CONN IC DIP SOCKET 32POS TINLEAD TE Connectivity AMP Connectors |
2,062 | - |
RFQ |
Ficha técnica |
Box | - | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | - | Phosphor Bronze | - |
|
1-822473-6CONN SOCKET PLCC 68POS TIN TE Connectivity AMP Connectors |
3,871 | - |
RFQ |
Ficha técnica |
Box | - | Obsolete | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Thermoplastic |
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